PCB Solutions Multilayer PCB

Advanced thermal management and embedded coin technologyHigh Performance and Emerging Materials; Halogen free,low loss,ultra-thin,mixed packages, inlaySequential LaminationHigh Tech Drilling Capability – Small hole drilling, Backdrilling  Mechanical depth control drilling with +/-10um tolerance,min drillsize 0.15mmUltra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm)http://www.hemeixinpcb.com



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