10Layer Immersion gold 35um with high TG170 board

Layer count: Rigid PCB 2 - 24 + Layers; Rigid-flex PCB 1 - 10LayersPanel Size(max): 21" x 24" for Rigid, 9.05'' x 47.2'' for FPCMaterials: FR-4, roger, high-TG FR-4, halogen-free FR-4Board thickness: 0.016" to 0.120"Copper weight: Heavy copper PCB (6oz finished)Finishing: hot air leveling/HASL(lead free),Immersion gold, immersion silver,gold fingers, carbon ink, OSP, peelable maskMinimum finishing hole size:0.006" Thru Hole (Finished Size) and 0.004" Buried Via,Hole Size Tolerance: ±0.05mm(PTH); ±0.05mm (NPTH)Aspect ratio: 10:01Outline Dimension Tolerance: ±0.13mmConductor Width Tolerance: ±0.05mm or ±20%of Original ArtworkWarp & Twist Ratio: 0.70%Insulation Resistance For E/T test: 10K Ω-20M ΩConductivity Resistance For E/T test: <50 ΩVoltage For E/T test: 300v maximumRegistration Tolerance Front/Back Image: 0.075mmLayer to Layer Registration: 0.075mmBoard Thickness Tolerance: ±8%(t≥1.0mm); ±0.1(t<1.0mm);Plugging hole Diameter with solder mask: 0.20mm-0.60mmMinimum Solder dam Width: 0.1mmMinimum Solder Mask Clearance: 0.05mmSolder Mask Type/Silkscreen Ink: LPI(green, white, black ,red ,etc)Outline profile: punching, routing, punch and push backAu thickness: 0.0762um-0.762um(Hard Au); 0.0254um-0.127um(Soft Au);Ni thickness: 2.032-7.362umhttp://www.zitrok-pcb.com



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