10Layer Immersion gold 35um with high TG170 board
| Layercount:RigidPCB2-24+Layers;Rigid-flexPCB1-10LayersPanelSize(max):21"x24"forRigid,9.05''x47.2''forFPCMaterials:FR-4,roger,high-TGFR-4,halogen-freeFR-4Boardthickness:0.016"to0.120"Copperweight:HeavycopperPCB(6ozfinished)Finishing:hotairleveling/HASL(leadfree),Immersiongold,immersionsilver,goldfingers,carbonink,OSP,peelablemaskMinimumfinishingholesize:0.006"ThruHole(FinishedSize)and0.004"BuriedVia,HoleSizeTolerance:±0.05mm(PTH);±0.05mm(NPTH)Aspectratio:10:01OutlineDimensionTolerance:±0.13mmConductorWidthTolerance:±0.05mmor±20%ofOriginalArtworkWarp&TwistRatio:0.70%InsulationResistanceForE/Ttest:10KΩ-20MΩConductivityResistanceForE/Ttest:<50ΩVoltageForE/Ttest:300vmaximumRegistrationToleranceFront/BackImage:0.075mmLayertoLayerRegistration:0.075mmBoardThicknessTolerance:±8%(t≥1.0mm);±0.1(t<1.0mm);PluggingholeDiameterwithsoldermask:0.20mm-0.60mmMinimumSolderdamWidth:0.1mmMinimumSolderMaskClearance:0.05mmSolderMaskType/SilkscreenInk:LPI(green,white,black,red,etc)Outlineprofile:punching,routing,punchandpushbackAuthickness:0.0762um-0.762um(HardAu);0.0254um-0.127um(SoftAu);Nithickness:2.032-7.362um |
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