MECHANIC 3D Middle Layer BGA Reballing Stencil for iPhone X A12
Mechanic 3D stencil for iPhone X motherboard middle layer soldering repair. Mechanic 3D-X-PRO middle layer stencil with positioning base for iPhone X motherboard repair. Mechanic 3D Square Hole BGA Reballing Stencil steel mesh middle layer positioning tool for iPhone X A12.
Option:
1.3D-X stencil only: for iPhone X.
2.3D-X Pro stencil with base: for iPhone X
Description:
Mechanic 3D BGA Reballing Stencil for iPhone X Motherboard Middle Layer, iPhone X A12 PCB groove Reballing Stencil Template, New patented iPhone X Middle Layer Motherboard 3D BGA Reballing Stencil template, used for assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
Features"
- Made of high temperature resistant synthetic stone
- 0.3mm thickness, easy to scrape tin, high strength, not easy to deform
- Durable, easier to take off the net, more efficient
- Mini size, can put under microscope for use,easy to observe
- 3D Design,stable use, precise plate tin
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