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Sunkye R04S Space Grade Micro D Solder Cup Type Connector

Micro-D Sub Connectorsfor space applications.

Twist pin contacts, high density interconnection, 1.27mm contactspacing and 1.1mm spacing between rows.

Contacts:9,15,21,31,37, A51,51,69,100pins.

Brief Introduction of Sunkye R04S Space Grade Micro D Solder Cup Type Connector

Product feature:small and light, antivibration etc. high performance.

The solder cup can mate with AWG26 and AWG28 wire.

Meet space applications.

Material and Finish of Sunkye R04S Space Grade Micro D Solder Cup Type Connector

ltem

Material

Finish

shell

Aluminum alloy

Electroless nickel plating

insulator

20%FPPS

-

seal ring

Silicone rubber

-

contacts

copper alloy

gold plating

locking hardware

stainless steel

passivation

backshell

Aluminum alloy

Electroless nickel plating

Electrical Performance of Sunkye R04S Space Grade Micro D Solder Cup Type Connector

Performance

Marking

Rating Value

Current rating(max)

I

3A (24#),13A(16#)

Dieletric withstanding voltage(sea level)

U

800 Vr.m.x(50Hz)

Contact resistance

R

≤10mΩ (24#),≤5mΩ (16#)

Insulation resistance(500VDS,sea level)

R

≥5000MΩ

Specification of Sunkye R04S Space Grade Micro D Solder Cup Type Connector

Environment: -55℃ ~+125℃

Contact resistance:≤ 21mΩ

/

Vibration: 10Hz~ 2000Hz, 294m²/s

Insulation resistance:≥5000MΩ 100VDC

/

Shock: 980m/s² 6ms

Dielectric strength: 250V

EIA-364-28, test condition IV

Rated current: 1A

Machine life: 200 times

/

Random vibration: Power spectral density O.4G²/Hz, root mean square value of total acceleration 23.1G

EIA-364-27, test condition E

Salt spray

96h

EIA-364-26, test condition B

Humidity

240h

ElA-364-31, test condition IV

Thrmal shock

-55℃ ~+125℃

EIA-364-32, test condition IV

Contact engaging and separating force

/

Irradiation resistant

Total dose:1X105Gy

/

hermal vacuum outgassing

TML≤1%, CVCM≤0.1%

/

Magnetic permeability

200 gamma

/

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