Adhesive for Camera Module
Introduction
With the increasing demand for consumer electronics and the development of autonomous driving in automobiles, the demand for camera modules in the consumer electronics and automotive markets has significantly increased, and the demand for adhesive parameters in this application is also constantly increasing. The camera module has extremely high requirements for the precipitation, strength, aging resistance, as well as the morphological changes, thermal expansion changes, and curing efficiency of the adhesive after curing. For example, the lens part has good temperature resistance, light resistance, and aging resistance when in contact with the outside for a long time, and the precipitation rate is strictly controlled to avoid contaminating the lens and affecting imaging.
Camera module is one of the key industries that Hansi Electronics focuses on and invests in. In response to this market, Hansi Electronics continues to invest in research and development, as well as technological resources for innovation. We can provide comprehensive camera module bonding solutions, including lens holder alignment, filter bonding, lens bonding, barrel bonding, lens holder bonding, FPC reinforcement, VCM motor bonding, including UV glue, UV thermosetting, low-temperature epoxy and other technical categories.
| Property | Camera Adhesive |
|---|---|
| Composition | Epoxy or acrylic-based formulations with low shrinkage and high thermal stability. |
| Curing Method | UV/LED curing or thermal curing (heat-activated). |
| Key Applications | Bonding camera lenses, image sensors, and modules; securing components in high-precision assemblies. |
| Advantages | High bond strength, resistance to thermal cycling/vibration, low outgassing (NASA ASTM E595 compliant). |
| Limitations | Brittle if not properly formulated; requires precise application for optical alignment. |
| Industry Use | Critical in smart, automotive, and aerospace camera modules for reliability. |
Notes:
UV-Curable Adhesives: Enable rapid processing in manufacturing, often used for active alignment applications.
Thermal Stability: Ensures consistent performance in temperature-sensitive camera environments.
Low Outgassing: Important for vacuum-sealed or sensitive optical components to prevent contamination.
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