Thermal Paste RJ-723A

Description Composition: Metal Oxide Compounds: 40% Carbon Compounds: 15%~20% Silicone Compounds: 40%~45% Thermally conductive compound RJ-723A is specially formulated for thermal performance. Applications CPU chip Electric iron Water dispenser Television Air conditioner Power modules Heat sink Diode Triode Any interface that requires a high performance thermal grease


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Thermal Paste RJ-723A
Thermal Paste RJ-723A
Modified Alkyl Aryl Polysiloxane RJ-6017
Modified Alkyl Aryl Polysiloxane RJ-6017
n-Octyltriethoxysilane
n-Octyltriethoxysilane
siloxane / silane emulsion wp03
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Potassium Methyl Siliconate(CAS No.: 31795-24-1)
Potassium Methyl Siliconate(CAS No.: 31795-24-1)
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