CPU Thermally conductive pad

it is designed with very good high thermal conductivity and coherent winding, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.  Features & benefits: 1.High compressibility, soft and flexible, designed for applications in low-stress application environment 2. Nice thermal conductivity 3. Electrical insulation 4. Meet with the environmental requirements of ROHS and UL 5. Natural stickiness Typical applications: 1 .Laptop 2. Communication hardware equipment 3. High-speed hard disk drive equipment 4. Automobile engine control mould 5. Micro processor, memory chip and graphics processor 6 Mobile equipment


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