Type4 Sn64.7Bi35Ag0.3 Solder Powder
Product DetailsBBIEN LF-04 type4 Sn64.7Bi35Ag0.3 solder powderDescription for BBIEN LF-04 Sn64Bi35.7Ag0.3 powderSn64.7Bi35Ag0.3 solder powder is a low-energy atomization technology production of spherical alloy solder powder,under accurate monitoring by the computer,It is carrying out the high quality standard of the alloy solder powder,can satisfy with the high quality demand of the solder paste.We can also according to customer requirements produce all kinds of special performance products.Solder powder basic KnowledgeSmall variations in composition and the level of impurities can affect wetting properties of the solder paste:oxidation behavior,melting temperatures,flow within the joint and joint strength.The ideal solder composition will feature tight tolerances of alloy composition.The J-STD-006(Joint Industry Standard)places requirements on the content of alloying elements.For alloys with 5%of less of an element,its content must not vary by more tan 0.2%by weight.For elements contents higher than 5%the acceptable variation from the nominal is extended to 0.5%.Because of possible deleterious effects on the solder limits also are placed on the presence of 14 impurity elements.For instance,aluminum cadmium and arsenic impurities induce dewetting,and sulfur blamed for joint grittiness.However,even when the alloy’s composition is within the industry specification small variations in elemental content can affect joint aesthetics.One joint can turn out smooth and shimmy while another will display a dull an grainy appearance. To deal with these issues,paste manufacturers often impose in-house specifications that feature strict composition tolerances.Availability:Available type:it is available in Sn64.7Bi35Ag0.3 type 4 powder mesh is normally recommended,but type3, type5, type6 and type7 are all skilled and available for this alloy solder paste.SortChemical composition(wt.%)SnPbSbCuBiAgAsFeInAlCdSn64.7Bi35Ag0.3Bal.<0.030<0.01<0.00135±0.50.2~4<0.003<0.001<0.0001<0.01<0.02Metal compositionPhysical FeatureAlloy componentMeltingpoint℃SuggestingWorking temperature℃Gravity g/cm3Rigidity HBConduct heatM.S.KExtendMpaExtendrate%Conductivity%Sn64-Bi35-Ag1152~179100~2508.1-8..2Feature of Sn64Bi35.7Ag0.3 solder alloy powderSome important features include high powder density close to the theoretical density of the alloy and no internal voids or external satellites(microspheres attached to a single sphere).The trained eye of a technician often evaluates some of those properties.Others are governed by formal test procedures.For example,powder flow can be tested according to ASTM B-213,and the presence of voids can be checked by microscopic examination of cross section of individual particles.The user can identify the powder by both composition and type.Alloy composition refers to the main alloying elements;type to the range of particle(mesh)sizes.Packing Details:.SpecificationSn64.7Bi35Ag0.3Appearancegray tacky powderWeight1kg or 5kg per vacuum bag filled with nitrogen;25kg per plastic drumBBIEN's solder powder as followSNAlloy BrandSolidus TemperatureLiquidus TemperatureDensity g/cm3Available type size1Sn42Bi581391398.8Type3~type72Sn64Bi35Ag11511728.2Type3~type73Sn64.7Bi35Ag0..1Type3~type74Sn42Bi57.7Ag0..3Type3~type55Sn96.5Ag3.0Cu0..54Type3~type76Sn99Ag0.3Cu0..43Type3~type77Sn63Pb.4Type3~type78Sn62Pb36Ag.62Type3~type7Exporte countries:Pakistan,South Korea,Russia,Colombia,America,Mid-east countries,Brazial,Iran,Egype,Thailand.Health&Safety:This product,during handling or use,may be hazardous to health or the environment.Read the Material afety Data Sheet and warning label before using this product.Application:BBIEN’S LF-04 Sn64.7Bi35Ag0.3 RoHS standard solder powder are used in the assembly of printed circuit boards(PCBs)for a wide variety of applications,including hand-held electronic devices such as smart s and tablets,computer motherboards,consumer electronic products,network servers,automotive systems,medical and military equipment and many others.
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