High TG 8 Layer PCB Multilayer For USB Flash Memory Pcb Board In Panel Size
High TG 8 layer PCB multilayer for USB flash memory pcb board in panel size Xinchenger Electronics co.,Ltd established in 2002,we have commited ourselves to manufacturing various of hi-frequency microwave pcb and multi-layer board including fastest sample production. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth.our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality.furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available. Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people. With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future. Shenzhen Xinchenger Electronics was a leading manufacturer of high frequency and high difficult pcb circuit board for many years in shenzhen.We have newest pcb machine like laser drill machine,can do min2mil line space and width for you. With these top technology,we can meet all your requirements,such as 24 hours quick sample service,rogers&fr4 mixed compression,4-28 multilayer lamination,crossed blind buried vias hole and so on.Any inquiry can feel free to send us to check if we are able to manufacture your boards.We have professional engineer with more than 10 years pcb working experience can understand all your detail requirements whatever Chinese or English. Model Number:XCEPCB0014 Shipping port:ShenZhen/HongKong Place of origin:GuangDong,China Delivery Time:3-10 Working Days Production capacity:FR4:2000000Sqms High Frequency board:10000SqmsPrice Terms:FOBMinimum Order Quantity:1pcPayment terms:TT,Paypal,Western UnionCertification:CE,ROHS,FCC,ISO9008,SGS,UL Material:FR4Soldermask:BlackMolde Number:xcepcb0014Silkscreen:WhiteLayer:8Panel Size:297*101mm/5pcsBoard Thickness:1.0mmPackage Details:Inner:Vacuum-packed Bubble bag With Foam Outer:Carton BoxMin Line Space:4MilMin Line Width:4MilMin Hole Size:10MilFinished Surface:ENIGSpecial requirement:BGAResin HoleProvide Slice reportFinished Copper:1ozDelivery Time：8 DaysSpecification:High TG 8 layer PCB multilayer for USB flash memory pcb board FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products. The mechanical properties of epoxy glass fiber cloth substrate, size stability, impact resistance, moisture resistant to higher than paper substrate. Its excellent electrical performance, high working temperature, itself performance affected by environment. On the processing technology, than other resin fiberglass cloth substrate has great superiorityRadio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cells to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics. The main parameters of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example)Yellow and white core plate divided core material, usually white core material;Sheet Size: 36 "* 48", 40 "* 48", 42 "* 48", 37 "* 49", 41 "* 49", 43 "* 49";Thickness: 0.10mm, 0.10MM behind by increments, usually the thickest of 3.20mm, 0.30mm or less can do multilayer core board, 0.60MM surface treatment can not do the following HAL, complete the following press thickness 1.00mm thickness the thickness of ± 0.10,1.00mm by more than ± 10%;Sheet copper thickness: 1 / 3OZ-12um, 1 / 2OZ-17.5um, 1OZ-35um, 2OZ-70um, 3OZ-105um, etc;TG value: glass transition temperature, the material begins to be interpreted as a softening point of the glass as the temperature in the molten state. Normal TG (≤140 ℃), the TG (150 ℃), high TG (≥170 ℃)CTI Definition: comparative tracking index; divided into six grades: 1 (CTI≥600V), 2 (600V> CTI≥400V), 3 (400V> CTI≥250V), 4 (249V> CTI≥175V), 5 ( 175V> CTI≥100V), 6 (100V> CTI≥0V);Dielectric constant (Er): general value 4.2-4.5;Thermal decomposition temperature (TD): typ. 305 ℃; Company Service:24 hours quick sample is avaliable here.reply Customer's any enquiry within 3 hours;Blind buried hole ,crossed blind hole can be done24 hours Engineering Gerber files treatment.24 hours English Engineering Questions Confirmation by E-mail.Supply the best project fit for production customized Competitive Advantage:1) With UL,ROHS,ISO,IPC2).Lead time:3-10 working days3)Competitive price best quality4).Rich 20 years experience in High Tg Multilayer PCB . What Information customer need to provide for quotation ?1. PCB Gerber files ,protel,powerpcb,Autocad,etc.2. BOM list for PCB assembly.3. Send us your sample PCB or PCBA.4. OEM is acceptable. Contact Information:Karen-Sales DepartmentShenZhen Xinchenger Electronic
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