Pure Tin 99.95% Solder Wire Sn99.95
Product DetailsPure tin 99.95%solder wire Sn99.95Product IntroductionBBIEN environmental pure solder wire LF-06 Sn99.95 is developed to comply with the IEC and JPCA halogen content specifications,complying with the recent trend for environmental protection.LF-06 Sn99.95 lead free solder wire also apply for the highest industry standards for electro-chemical electonics.Diameter of pure tin solder wire Sn99.95 is 0.8mm and 1.0mm,packing 1kg/spool.FeatureBBIEN is willing to work with you in good relationships to refine the performance lead-free solder.1)Little impurity,diffusion capacity well2)Weldability,good fatigue resistance3)Solder joints,solder surface brightness,good wetting4)strong antioxidant,anti-creep5)Increase production speed,reduce production costsSn99.95 pure tin solder wire is no flux core type and no clean,reliability and is very fast wetting with low flux spatter,setting the new standard in performance and reliability.Its clear non-tacky residue does not require cleaning,and its excellent joint appearance allows for easy inspection also generates a low amount of fumes,thus creating a clean and operator friendly working environment.Production SpecificationProduct TypeSolder wire Sn99.95BrandBBIENMaterialPure tin solder wireComposition99.95%tinMelt point1217 degree CelsiusFlux contentno fluxApplicationMetal soldering,electronicsDensity(g/m^3)7.4Diameter1.0mm,,2.0mmPacking500g/spool,1kg/spoolTypeno flux core solder wire;no clean typePlace of originMade in China,Shenzhen CityKeywordPure tin soldering wire Sn99.95Tin wire,pure tin wire,tin99.95%solder wirePure tinApplication:The increased function of personal electronic devices,such as mobile s and personal music devices,has driven the need for smaller and smaller active and passive components.This trend toward miniaturization,occurring at the same time as the conversion to RoHS-compliant BBIEN LF-06 pure tin lead-free solder wire assembly,has been a considerable challenge to the electronics assembly industry.The main reason for this is the higher reflow process temperatures required for Pb-free assembly.These higher temperatures can thermally damage the PCB and the components.In addition,the higher reflow temperatures can negatively affect the solder joint quality,especially when coupled with the smaller paste deposits required for these smaller components.If additional thermal processing is required,the risk increases even more.
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