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OV13850CSP-V3.0 BGA test socket test fixture 1

ShenzhenYounRongDamicroelectronicstechnologyco.Ltdisaprofessionalsemiconductortestprogramdevelopment,manufacturingandsalesenterprises,withtenyearsofresearchandtestingsocketmakingexperience,.Wemainlyprovidechiptestsocket,burningfixture,programmingdevice,EMMC/TSOPtestsocket,camerachiptestsocket(sensor),automatedtestsocketandconnectortesting.

Contact:Gracexie

Phone:

Mobile:

Otherchip:BGA272,BGA16,HI3512RBC,LC822973,SMS4470,AFE5805,MT9VO11,PLCC40-SNAP,S0101-CSP

OV13850CSP-V3.0BGAtestsocketfeature

Size:8.5*8.5*1.28

Pitch:44

  1. Uppercoveradopthandrotatestructure,sensitiveoperation.2.Pressplateofsocketheadadopthumanizationstructure,balancepress,guaranteeICpressequality,andwon’tskewing.3.CrownshapeofPogopinbeabletobreakoxidelayerofsolderball,contactstable,protectsolderballshape.4.Rationalizationlocatingslot,GuideholecanmakesureIClocationright.5SpecialICsupportplatestructure,protectPogopinfreeofoutsideforce.
  2. importPogopin,BECUplatedhardgolden,rhodium.Worklifetimeover100000times.
  3. Lowcostformaintenance,easytochangepin,costefficiency.
  4. Matureworkingaccuracyrange:pitch=0.3mm

10.Deliverytime:inthreedaysearliest.

YuanRongDaserviceprotectionaftersale.

  1. Freemaintenancein100days(exceptman-madedamage)
  2. Freemaintenanceafterwarranty,onlychargematerialcostiftherehavenecessary.
  3. YuanRongDafreeproviderelatedtechnicalsupport.

YuanRongDaservicebeforesale.

  1. Provideoperationspecificationandmaintenanceitems..
  2. Freetrainhowtousethisproduct.


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