Large-Area 3D Optical Surface Profilometer
Whats/App: +86 156 1874 6768
Web: standard-groups.com
Large-Area 3D Optical Surface Profilometer is a high-performance three-dimensional optical metrology system designed for large-area surface topography measurement. It combines high-speed scanning, multiple imaging technologies, and ultra-high vertical resolution to deliver accurate and repeatable 3D surface data across a wide range of sample sizes and material types. By integrating six imaging and analysis methods on a single platform, this system enables nanoscale surface characterization while maintaining excellent efficiency and measurement flexibility.
Application
The Large-Area 3D Optical Surface Profilometer is suitable for surface morphology analysis and dimensional evaluation of various materials and components, including but not limited to:
Semiconductor wafers and microelectronic devices
Thin films and optical coatings
Precision mechanical components
Functional surfaces with large slopes or low reflectivity
Transparent or multilayer materials
Micro- and nano-structured surfaces
Typical test objects include wafers, devices, thin films, coated components, and precision assemblies requiring large-area, high-resolution surface measurement.
Standards
The system’s analysis capabilities and software design support surface metrology requirements defined in relevant international standards, including but not limited to:
ISO 25178 (Surface texture: Areal)
ISO 4287 / ISO 4288 (Surface roughness parameters and evaluation)
ISO 16610 (Filtration of surface texture)
ISO standards for optical surface measurement and reporting
Parameters
| Parameter | Specification |
|---|---|
| Imaging speed | High-speed camera up to 200 FPS |
| Z-axis resolution | Sub-nanometer resolution, independent of objective magnification or scan range |
| Imaging technologies | White light interferometry, confocal, spectral film thickness, bright field, dark field, zoom imaging, AFM |
| XY stage | Modular precision XY stage, customizable up to 300 × 300 mm |
| Sample compatibility | Wafers, devices, thin films, components, large-area samples |
| Software | ISO-compliant analysis software with automated measurement and reporting |
Features
Six-in-one integrated imaging and analysis platform
High-speed camera enabling rapid surface acquisition
Sub-nanometer vertical resolution for precise height measurement
Modular and scalable platform for large-area samples
High-resolution spinning disk confocal scanning for fast area imaging
Physical suppression of scattered light to improve image contrast and accuracy
Advanced software for automated analysis and standardized report generation
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