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Large-Area 3D Optical Surface Profilometer

Whats/App: +86 156 1874 6768

Web: standard-groups.com

Large-Area 3D Optical Surface Profilometer is a high-performance three-dimensional optical metrology system designed for large-area surface topography measurement. It combines high-speed scanning, multiple imaging technologies, and ultra-high vertical resolution to deliver accurate and repeatable 3D surface data across a wide range of sample sizes and material types. By integrating six imaging and analysis methods on a single platform, this system enables nanoscale surface characterization while maintaining excellent efficiency and measurement flexibility.

Application

The Large-Area 3D Optical Surface Profilometer is suitable for surface morphology analysis and dimensional evaluation of various materials and components, including but not limited to:

Semiconductor wafers and microelectronic devices

Thin films and optical coatings

Precision mechanical components

Functional surfaces with large slopes or low reflectivity

Transparent or multilayer materials

Micro- and nano-structured surfaces

Typical test objects include wafers, devices, thin films, coated components, and precision assemblies requiring large-area, high-resolution surface measurement.

Standards

The system’s analysis capabilities and software design support surface metrology requirements defined in relevant international standards, including but not limited to:

ISO 25178 (Surface texture: Areal)

ISO 4287 / ISO 4288 (Surface roughness parameters and evaluation)

ISO 16610 (Filtration of surface texture)

ISO standards for optical surface measurement and reporting

Parameters

ParameterSpecification
Imaging speed High-speed camera up to 200 FPS
Z-axis resolution Sub-nanometer resolution, independent of objective magnification or scan range
Imaging technologies White light interferometry, confocal, spectral film thickness, bright field, dark field, zoom imaging, AFM
XY stage Modular precision XY stage, customizable up to 300 × 300 mm
Sample compatibility Wafers, devices, thin films, components, large-area samples
Software ISO-compliant analysis software with automated measurement and reporting

Features

Six-in-one integrated imaging and analysis platform

High-speed camera enabling rapid surface acquisition

Sub-nanometer vertical resolution for precise height measurement

Modular and scalable platform for large-area samples

High-resolution spinning disk confocal scanning for fast area imaging

Physical suppression of scattered light to improve image contrast and accuracy

Advanced software for automated analysis and standardized report generation


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