FPC UV Laser Cutting Machine JG18
Laser Cutting Machine
Usage
The machine is used to cut cover layer CVL, flex printed circuit board FPC, flex-rigid circuit board RF. Includes base materials, such as: silicon, ceramics, rubber, FR4, 3M, PP, PI reinforcement; with high quality, high speed cutting thickness of up to 1mm (0.04). There is no burrs, no stratification. The cutting edge and sidewall is smooth.
Feature
1、Precision:Adopting linear motor module,Servo control, sizing compensation, optical positioning and secondary positioning technologies.
2、High quality: Little carbonization and high density graphics cutting.
3、Highly intelligent、efficient:With multi-panels cutting、auto-positioning、auto-correcting、automatic sizing compensation and exclusive cutting previews functions.
Parametres
Specification of href="" UV Laser Cutting Machine |
|
Model |
JG18 |
Wavelength |
355nm |
Laser Power |
Option (Standard10W) |
Laser Frequency |
30-120kHz |
Maximum Processing Size |
720mm x540mm (Double platform) |
Maximum Operating Speed |
800mm/s |
Positioning Accuracy of Table |
±3μm |
Repetitive Positioning Accuracy of Table |
±1μm |
Total Accuracy |
±20um |
light spots |
20±5μm |
Scanning range |
45mmx45mm |
File Format |
*.gbr & *.dxf & *.lay |
Electric Power Supply |
AC220V/2kW;AC380V/5.5kW |
Dimensions(L x W x H) |
1780mmx1610mmx1650mm |
Weight |
2300kg |
Environmental Temperature |
20±2℃ |
Environmental Humidity |
≤60%RH,Non-condensing |
Ground Amplitude |
≤5μm |
Ground Pressure |
≥1000Kgf/m2 |
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