Diamond Cutting Discs, Diamond Saw Blade
Diamond Cutting Discs, Diamond Saw Blade
Our expapplicationertise encompasses a broad range of electronic materials including Mono Crystalline and Poly Crystalline Silicon, Sapphire ,Quartz, Specialty glasses, and a variety of other hard compounds and ceramics. Whether your concern is part quality or productivity, “MORESUPERHARD” dicing blades step up to the challenge.
Our standard and custom specifications are available in a variety of bond, hardness and diamond or cubic boron nitride(CBN) Grain sizes to meet your material removal, Heometry , chipping, and surface finish requirements. We also offer the broadest range of blade sizes and bond systems including sintered and plated metal as well as resin for maximum engineering flexibility.
Our cutting discs are mainly including Resin diamond dicing blade, Metal bond dicing blade andElectroplated bond dicing blade.
Specificationof diamond cutting discs (including resin bond , electroplated bond and metal bond ):
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Product Name |
Resin/Electroplated/Metal bond dicing blade |
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OD |
50-125mm |
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ID |
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Grit |
200#-5000# (D107-D1) |
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Thickness |
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According to customers’requirement Email:
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