High-frequency Spindles For Wafer Dicing Or Silicon Plate Cutting
High-frequency spindles for cutting performanceZYS high-frequency spindles for wafer dicing use air static pressure bearings,Website:, and the wafer scriber spindles have high precision, low vibration, steady rotation and reliable performance.ParametersTypeSpeedr/minKWVoltageVCurrentAFrequeceHz92GD40Q400000.752202.666680GD30Q300000.51652.5500
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laser roughness measuring instrument PerformanceZYS had been successfully developed Series CU Laser roughness measuring instrument in the eighties,... |
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High-frequency spindles for rotation-rolling performanceZYS rotation-rolling spindles,Website:, electric spindles, are used in machining the inner... |
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Ball screw support bearingsZYS precision Ball screw support bearing is a kind of one-direction angular contact thrust ball bearing (60° contact ang... |
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High-Speed Roundness & Waveness Measuring Instrument Roundness is an important indicator of production quality. The value of bearing parts roundne... |
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Bearing Steel,Website: Relevant Materials |
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