HY-9055 of Electronic Potting Silicone Rubber
- ProductFeatureofElectronicPottingSiliconeRubberHY-9055siliconerubberisakindoflowviscosity,Inherentflameresistance,twocomponentsadditioncuredpottingsiliconewithheat-conducting.Itcureswithbothonroomtemperatureandheatedtemperature.Ithasthefeatureofthehighertemperaturethefasterofthecuringtime.Itcanbeappliedtoelectroniccomponentsforinsulation,waterproofing,fixedandflameretardant.ItmainlyappliedinelectroniccomponentssurfacewithmaterialsofPC(Poly-carbonate)、PP、ABS、PVC,etc.andmetalmaterials.
- TypicalApplicationofElectronicPottingSiliconeRubber
HY-9055electronicpottingsiliconerubbercouldbeappliedto
-highpoweredelectronics,
-DC/DCmoduleandcircuitboardwhichrequiresheatdissipationandhightemperatureresistance.
-ItcanbebroadlyusedforLEDscreen,WindPowerGenerator,PCBsubstrate,etc.
- TechnicalGuidelinesofofElectronicPottingSiliconeRubber
a,PlsputpartAandpartBinseparatecontainerandstirevenlybeforemixingthetwoparttogether.
b,MixingRatio:partA:partB=1:1
c,Deaerationthemixtureinvacuumpumpunder0.08MPafor3-5minutes.Thenthemixturecouldbeusedforpouring.
Note:Thethicknessofthesiliconeaffectsthecuringtime.Ifthesiliconeusedisalittlethick,thenthecuringtimewillbealittlelonger.Thetemperaturealsoaffectsthecuringtime.Wheninlowertemperature,wesuggestcustomersappropriatelyheatthemixturetoacceleratevulcanization.Withtemperatureof80～100℃,thesiliconewillcurein15minutes;whilein25℃roomtemperature,thesiliconewillcurearound8hours.
- NotesofElectronicPottingSiliconeRubbera.ThefollowingmaterialmayhinderthecuringofHY-9055,Soplsuseafterthetest.Whennecessary,plscleantheapplicationareas.
OrganotincompoundorCondensationsiliconewithorganotin
Sulphur,sulfideandsulfurrubbermaterials.
Aminecompoundsaswellascontainstheaminematerials.
Pewterssolderflux
b.HY-9055shouldbesealedstorage.Themixtureshouldbeusedupdisposablytoavoidcausingwaste.
c.HY-9055belongstonon-dangerousgoods,butkeepawayfrommouthandeyes.
d.Whenitgetsstratifiedafteraperiodofstorage,Pleasemixitevenlybeforeusing,whichdoesnotaffecttheperformance.
TechnicalParametersofofElectronicPottingSiliconeRubber
|
Features |
PartA |
PartB |
|
|
BeforeCuring |
Appearence |
GrayFluid |
WhiteFluid |
|
Viscosisty（25℃cps） |
2500±500 |
2500±500 |
|
|
Operationfeatures |
MixingRatio |
1：1 |
|
|
Viscosisty(aftermixing)（cps） |
2000～3000 |
||
|
OperatingTime（25℃hr） |
120 |
||
|
Curingtime（min，25℃） |
480 |
||
|
Curingtime（80℃hr） |
20 |
||
|
AfterCuring |
Hardness（ShoreA） |
55±5 |
|
|
Thermalconductivity[W（m·K）] |
≥0.8 |
||
|
DielectricStrength（KV/mm） |
≥25 |
||
|
Permittivity（1.2MHz） |
|
||
|
VolumeResisivity（Ω·cm） |
≥1.0×1016 |
||
|
linearexpansibility[m/（m·K）] |
≤2.2×10-4 |
||
|
FireResistance |
94-V1 |
||
(Plsnote:theabovedataforthisproductin25℃temperature,55percenthumidityconditions,forreference.Theaccuratedataismeasuredbycustomerswhenusing.)
PACKAGE40Kg/pailasaset(PartA20Kg+PartB20Kg)
Anyquestionsofliquidmoldingsiliconerubber,pleasefeelfreetocontactMsAngela:
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