Professional printed circuit board assembly process factory
Professional printed circuit boardassembly process factory
printed circuit board assembly process factory
● 4 YAMAHA High-speed SMT Lines
● 6 million daily SMT placements capability
● 400,000 daily DIP placements capability
● 500×600 mm Maximum Board Size
● 0.25"x 0.25" Minimum Board Size
● 450 mm Max. Width for Wave-Solder
● Passives Components Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement
SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test (ICT)/Flying Probe/Function Test/Burn-in/Finished products assembly
Professional printed circuit board
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