High-Precision Material Thermal Conductivity Tester (Guarded Hot Plate Heat Flow Meter Method)
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High-Precision Material Thermal Conductivity Tester (Guarded Hot Plate Heat Flow Meter Method) is a fully automated thermal property testing system designed for accurate measurement of thermal conductivity and thermal resistance using the internationally recognized heat flow meter principle. The instrument applies a stable controlled temperature to one side of the specimen, allowing heat to transfer through the material to a cooled surface, while the transmitted heat flux is precisely measured to calculate thermal conductivity and thermal resistance. Equipped with imported sensors and computer-based control and data processing, the system delivers high accuracy, strong reliability, and excellent repeatability, especially for low thermal conductivity materials.
Application
TheHigh-Precision Material Thermal Conductivity Tester is suitable for steady-state thermal performance evaluation of materials with low to medium thermal conductivity, including:
Thermal insulation materials
Plastics and polymer-based materials
Rubber and elastomer materials
Aerogel panels and advanced insulation boards
Vacuum glass and building energy-saving materials
Solid materials and powder materials (with appropriate sample configuration)
The instrument is widely used in universities, research institutes, quality inspection laboratories, and industrial material testing facilities for thermal conductivity and thermal resistance analysis.
Standards
The instrument is designed and operated in accordance with the following international and national standards:
GB/T 10295-2008
Thermal insulation — Determination of steady-state thermal resistance and related properties — Heat flow meter method
ASTM E1530
Standard Test Method for Evaluating the Resistance to Thermal Transmission of Materials by the Guarded Heat Flow Meter Technique
ASTM C518-04
Standard Test Method for Steady-State Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus
Parameters
| Item | Specification |
|---|---|
| Thermal conductivity range (low range) | 0.0001 – 1 W/m·K (resolution up to 0.1 mW/m·K) |
| Thermal conductivity range (extended) | 0.001 – 300 W/m·K |
| Measurement accuracy | ±1% |
| Sample size | 50 × 50 to 300 × 300 mm |
| Maximum sample thickness | ≤ 50 mm |
| Optional sample sizes | 600 × 600 mm, 800 × 600 mm (customized) |
| Applicable sample form | Solid materials, powder materials |
| Test duration | 15 – 20 min |
| Hot plate temperature range | Room temperature to 99.9 °C (standard) |
| Optional hot plate range | Room temperature to 499.9 °C or higher (by agreement) |
| Hot plate control accuracy | 0.1 °C |
| Cold plate temperature range | 0 – 99.9 °C (standard); –10 – 99.9 °C optional |
| Cold plate temperature control | Water-cooled, precision constant-temperature bath |
| Cold plate control accuracy | 0.1 °C |
| Pressure range | 0 – 1000 N |
| Pressure resolution | 0.1 N |
| Thickness measurement range | 0 – 50 mm |
| Thickness resolution | 0.1 μm |
| Heat flow sensor | Imported original heat flow meter |
| Test operation | Fully automatic computer-controlled testing and data storage |
| Power supply | AC 220 V / 50 Hz |
Features
Guarded hot plate heat flow meter method for steady-state thermal measurement
High sensitivity for low thermal conductivity materials, resolution down to 0.1 mW/m·K
Imported heat flow sensors ensuring stable and reliable performance
Computer-controlled temperature regulation and pressure loading
Automatic thickness measurement with high resolution
Excellent accuracy, repeatability, and long-term measurement stability
Automatic data acquisition, analysis, storage, and report generation
Suitable for both solid and powder materials
Accessories
Main testing unit
Thermal analysis software (Chinese and English versions)
HX-1005 precision low-temperature constant-temperature water bath (0.01 °C accuracy)
Computer (user-selectable)
Calibration reference sample
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