Thermal Conductivity Tester (Heat Flow Method)
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Web: qinsun-lab.com
Email：serving@qinsun-lab。com
Thermal Conductivity Tester (Heat Flow Method) is a high-precision instrument designed for measuring the thermal resistance, thermal conductivity, and interface contact thermal resistance of thin heat conductors, solid electrical insulation materials, thermal grease, resins, rubber, beryllium oxide ceramics, and aluminum oxide ceramics. The device can test solid sheet materials directly, and with the use of a sample frame, it can also measure powdered and paste materials. The tester is designed and manufactured in full compliance with ASTM D5470-2017 standards and has benefited from over 20 years of production experience, ensuring reliability, mature performance, and high testing accuracy. The system features servo-controlled precise automatic pressing, automatic thickness measurement, 6-point temperature gradient detection, and computer-controlled fully automatic operation. The built-in thermal guard around the test rod reduces environmental temperature influence, allowing accurate measurements of thermal conductivity, thermal resistance, and interface contact thermal resistance under varying pressures and temperatures.
The instrument is widely used in universities, research institutions, quality inspection laboratories, and industrial production plants for material thermal property analysis.
Standards
The instrument complies with:
MIL-I-49456A – Insulating Sheet Material, Thermally Conductive Resin, Glass-Fiber Reinforced Thermal Materials
GB/T 5598-2015 – Method for Determining Thermal Conductivity of Beryllium Oxide Ceramics
GB/T 29313-2017 – Test Methods for Thermal Conductivity of Electrical Insulation Materials
ASTM D5470-2017 – Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials
Parameters
| Item | Specification |
|---|---|
| Thermal conductivity range | 0.01–50 W/m·K (standard), 5–500 W/m·K (high conductivity mode, automatic software switching) |
| Thermal resistance range | 0.05–500 cm²·K/W |
| Sample size | Φ30 mm or 20×20 mm (standard); custom sizes: Φ15. Φ50. 25.4×25.4 mm |
| Sample thickness | 0.001–50 mm (standard); typical 0.02–20 mm |
| Hot plate temperature range | Room temperature–99.99 °C (standard); optional 299.9 °C or 500 °C |
| Cold plate temperature range | 0–99.99 °C; precision 0.01 °C (with high-precision low-temperature water bath) |
| Pressure range | 0–1000 N; servo motor controlled; precision 0.1 N |
| Thickness measurement range | 0–50 mm; resolution 0.001 mm; automatic |
| Sample quantity | 1 piece (single or stacked layers) |
| Measurement accuracy | Thermal conductivity/thermal resistance ≤3%; contact thermal resistance ≤5% |
| Test modes | Thermal resistance under varying pressures; material thermal conductivity; contact thermal resistance at different pressures; aluminum/composite boards; aging reliability tests; high-conductivity materials; compression performance tests |
| Automation | Computer-controlled fully automatic measurement and report output |
| Power supply | 220 V / 50 Hz; 1000 W |
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