Chemical Mechanical Polisher
Get a quote：
Web: qinsun-lab.com
Email：serving@qinsun-lab。com
The Chemical Mechanical Polisher is widely used in laboratory and pilot-scale environments for polishing process optimization and material behavior studies, including:
Semiconductor wafer polishing (Si, GaN and related substrates)
Optical component surface finishing
Substrate and thin material planarization
Aerospace material surface preparation
Research on friction, wear, and material removal mechanisms
Typical test objects include semiconductor wafers, optical substrates, bonded pads, and development samples with diameters from 0.5 inch to 4.25 inches.
Standards
The system is primarily intended for research and development applications. It supports experimental setups and evaluation methods commonly referenced in:
(1) Semiconductor CMP process research practices
(2) Optical surface finishing and planarization studies
(3) Tribology and wear mechanism investigation methods
Specific test standards depend on user-defined processes and research objectives.
Parameters
| Item | Description |
|---|---|
| Load Control | Closed-loop loading force control with high-precision force sensor |
| Torque Measurement | High-resolution online torque measurement |
| Wafer Holder | Self-leveling fixture with active rotation and horizontal oscillation |
| Sample Size Range | 0.5 inch to 4.25 inches |
| Platform | Fully automated XY platform with quick-change capability |
| Speed Control | Wide adjustable speed range via programmable control |
| Slurry Delivery | Automatic slurry delivery system |
| Inline Sensors | Torque, temperature, and acoustic emission |
| Surface Measurement | Integrated inline three-dimensional optical profiler |
Features
Real-time measurement of friction coefficient during polishing
Precise control of loading force and rotational speed through closed-loop feedback
Integrated three-dimensional optical surface profiler for inline morphology analysis
Compatibility with multiple wafer and sample sizes
Online monitoring of torque, temperature, and acoustic emission signals for accurate endpoint detection
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