.

Resin Bond Diamond Dicing Blades

High precision dicing

Improved cut quality on hard materials

Superior cut quality

Good wear resistance

PRODUCT DETAILS

Description: Resin bond dicing blade can Cut sapphire, quartz glass, silicon and other hard and brittle materials with quality and high-speed.

Application: Resin Bond Diamond Dicing Blades are suitable for cutting glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN (copper epoxy molding ), splitter, sapphire.

Advantages: 1.High precision dicing 2.Improved cut quality on hard materials 3.Superior cut quality 4.Good wear resistance


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