Resin Diamond Dicing Blade for semiconductor
Resin diamond dicing blade
Features: High Processing Quality For Cutting Of Hard, Brittle Material,
Able To Precisely Control Diamond Concentration,
To Achieve Cutting Quality; Improved Cut Quality On Hard Materials
Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, Splitter
Metal diamond dicing blade
Features: High Rigidityminimized Wavy And Slant Cutting ; Able To Control Diamond Concentration To Achieve Cutting Quality ;Excellent RigidityAnd Cut Quality
Application: Electronic Parts, Optical Devices, Semiconductor Packages, BGA, CSP
Electroformed Dicing Blade
Features: Wide Selection Of Blade Options; Proprietary Thin-Blade Technology ;Blade Thickness - 0.015 Mm To 0.3 Mm; Available For Both Dicing Saws And Slicers
Application: Various Types Of Semiconductor Packages, Ceramics, Magnetic Materials, PCB, Silicon
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