Flip Chip Technologies
Flip chip is a critical technology for miniaturization, and Topscom enjoys technical expertise in board assembly using several different forms, including:Solder Bumped Flip Chip TechnologyAnisotropic Conductive Adhesive Flip Chip TechnologyUltrasonic Bonding Flip Chip TechnologyIn addition, Topscom performs detailed analyses of equipment capability, materials requirements, process parameters, reliability, and process control.
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the Mechanical Technology Group helps provide customers with a completely integrated experience. The group pursues advanced technologies in materia... |
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Tooling design and manufacturing is one of Topscom’s key strengths. By staffing expert tooling designers, skilled tool and die makers, and precisio... |
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Products and ServicesTopscom has the ability to build virtually all multilayer board designs produced.Multilayer TechnologiesQTA and PrototypingHig... |
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Automated Optical Inspection (AOI) is a powerful tool for assessing workmanship compliance in Prototype as well as Production PCB assembly environm... |
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Topscom Electronics has a focused staff of Test Development engineers dedicated to Functional Test development. With the ownership of Functional Te... |
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