Thermal interface material
Thermal conductive sealant
There are two types of thermal conductive joint fillers: silicon-based and non silicon. They are usually two-component and can be cured at room temperature. They have certain impact resistance and stress relief properties and are used to fill gaps in electronic components. This type of material, when used in conjunction with heat sinks or metal casings, helps to promote the heat dissipation of critical electronic components. This type of non adhesive curing adhesive can form a soft interface that absorbs stress, fill uneven areas, and improve cooling efficiency, making it suitable for high-yield assembly applications. After complete curing, it has excellent thermal conductivity, corrosion resistance, insulation and other properties, mainly used for thermal conductivity in electronic devices and automotive power batteries.
Thermal conductive structural adhesive
Thermal conductive structural adhesive is a type of adhesive that combines thermal conductivity and high-strength bonding. It is usually composed of two-component polyurethane and epoxy resin, and can cure quickly at room temperature. The thermal conductivity and adhesive properties of thermal conductive structural adhesives can be effectively adjusted through pre-treatment of resins and fillers, as well as optimization of curing agent systems. After mixing two components, this type of product will gradually form an adhesive layer with good mechanical properties at room temperature. After complete curing, these products have excellent adhesion, corrosion resistance, insulation and other properties, mainly used for thermal conductivity bonding of automotive power batteries, and for PET, PA， Aluminum and other substrates have good adhesion.
Thermal conductive sealing adhesive
Thermal conductive sealing adhesive is a type of adhesive with low viscosity, high fluidity, which can be cured at room temperature or rapidly cured by heating. There are no solvents or curing by-products during the curing process, and it can be used for thermal sealing protection of electronic components. After curing, it has excellent electrical insulation properties, can withstand environmental pollution, and avoid damage to electronic products caused by stress, vibration, and humidity. It is especially suitable for products that require good heat dissipation for potting materials. This type of product, due to its excellent thermal conductivity, corrosion resistance, insulation and other properties, can be used for thermal sealing of motors and electronic components.
Sealing adhesive
Adhesive glue is a type of product used for structural bonding, replacing traditional mechanical locking. There are mainly two types: polyurethane and pressure-sensitive hot melt adhesive. Polyurethane structural adhesive is a two-component adhesive with moderate viscosity that can cure quickly at room temperature. After complete curing, this type of product has good toughness and exhibits good adhesion, corrosion resistance, insulation and other properties in different environments. It is mainly used for bonding automotive power battery packs and battery modules, and has good adhesion to substrates such as plastics, aluminum, and electrophoretic steel. Pressure sensitive hot melt adhesive is a semi dry solid that is coated on a substrate when heated to a molten state and has permanent adhesion after cooling. This type has good peel strength and can provide good adhesion under high temperature conditions. Compared with ordinary hot melt pressure-sensitive adhesives, it can provide moderate thermal stability. Mainly used for bonding power battery soft pack battery modules, it has good adhesion to substrates such as plastic and aluminum.
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