Bonding Powder for Electronic Iron Powder Cores/hybrid powder coating

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Product Usage:
Special bonding agent for molding electronic soft magnetic iron powder cores.

Product Features:

1. High mechanical strength: The surface of the molded components is smooth and dense. After curing, it has excellent adhesion to various metal powders, strong rigidity, good mechanical properties, and a high pass rate for finished products.
2. Low shrinkage of the cured product: The cured product has excellent dimensional stability, reducing precision errors caused by shrinkage stress during the curing process.
3. Excellent processing performance: It has good dispersibility and lubricity with metal powders, reducing friction between powders and molds during molding. The surface precision of the molded iron powder core is high, suitable for assembly line production.
4. Excellent electrical properties: The cured product has a very high glass transition temperature and a wide operating temperature range, maintaining optimal stable electrical properties between -65°C and 110°C.
5. Good dielectric properties: The cured components have excellent chemical and solvent resistance, withstanding organic chemical corrosion.
6. Energy-saving and environmentally friendly: The curing temperature is low and fast. It can be cured using the baking temperature of external painting or powder coating, saving energy. It is a 100% solid component with no harmful substances and is an environmentally friendly product promoted by the state.

Powder Performance:

Curing Conditions:

Addition Rate:
15-30% of the total metal powder volume, or adjusted according to the type and requirements of the component. No additional lubricants are needed when using this product.

Application Method:

1. Add the powder to the mixer according to the formula requirements, mix it with other components, and then proceed with molding.
2. After molding, the components can be placed in an oven for curing. The recommended curing temperature refers to the surface temperature of the component. Deviations in temperature may affect the bonding strength.

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