Epoxy potting sealants WOC-87-II(A)/113-1(B)
■ Description
Two-component encapsulating system based on epoxy resin,formed from auxiliaries including epoxy resin, diluent, compoundamine, cross-linking agent and defoamer by special production processing
Excellent of the surface gloss of the cured epoxy resin, High/Lowtemperature resistance is good, excellentelectrical properties and have flame retardant property.
■ Applications
Encapsulation of electrical components of Capacitor, Igniter, Transformer, trigger and Filter.
■ General properties
|
Test Item |
Test Mothed/Conditions |
WOC-87-II A |
113-1 B |
|
Appearance |
Visualization |
Black viscous liquid |
Dark brown liquid |
|
Density |
25º C g/m³ |
||
|
Viscosity |
40º C mpa.s |
1000 - 5000 |
20 - 80 |
|
Viscosity(blended) |
40º C mpa.s |
500 |
|
|
Storage validity |
Sealed and storage Temp.below 25º C |
6 months |
6 months |
|
Ratio of blend |
Weight/Weight |
100 |
20-25 |
|
Curing condition |
º C/hrs |
25 º C/24h |
|
■ Characteristics after curing
|
Item |
Unit/Conditions |
WOC-87-II A/113-1 B |
|
Hardness |
20º C Shore-D |
≥70 |
|
Insulation Strength |
25º C kv/mm |
≥18 |
|
Bending Strength |
Kg/cm2 |
≥82 |
|
High Temperature Resistance |
150º C |
Not cracking after 5 hours |
|
Flame Retardancy |
UL 94 |
V0 or V1 |
|
Surface Resistance |
25º C Ω.cm |
＞1014 |
|
Volume Resistance |
25º C Ω.cm |
＞1015 |
|
Curing Shrinkage Rate |
% |
＜0.6 |
Отправить запрос, связаться с поставщиком
Другие товары поставщика
 |
Epoxy Resin Adhesive for Battery EC-53 | ■ Description Adhesive for Cover container: is mainly used for the seal bond of cover and container. Excellent bond strength, good acid resistanc... |
 |
Epoxy potting sealants WOC-87-II(A)/2115(B) | ■ Description Two-component encapsulating system based on epoxy resin,formed from auxiliaries including epoxy resin, diluent, compoundamine, cross... |
 |
Epoxy potting sealants WOC-87-II(A)/G-8402(B) | ■ Description Two-component encapsulating system based on epoxy resin, formed from auxiliaries including epoxy resin, diluent, compound anhydride.... |
 |
Epoxy potting sealants WOC-87-II(A)/2125(B) | ■ Description Two-component encapsulating system based on epoxy resin,formed from auxiliaries including epoxy resin, diluent, compoundamine, cross... |
 |
Epoxy potting adhesives WOCC-A/WOCC-B | ■ Description Two-component encapsulating system based on epoxy resin, formed from auxiliaries including epoxy resin, diluent, Aluminum hydroxide,... |
Похожие товары
 |
Automotive & Marine Adhesive Sealant | Продавец: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | Automotive & Marine Adhesive Sealant is designed for demanding bonding and sealing appli... |
 |
MS waterproof coating sealant | Продавец: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | MS waterproof coating sealant MS Waterproof Coating Sealant GluePro is designed for liquid-... |
 |
MS Polymer Sealant For Window and Door | Продавец: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | MS Polymer Sealant For Window and Door GluePro is designed for professional home decoration,... |
 |
ODM-606 Water-Based Intumescent Firestop Sealant | Продавец: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | ODM-606 Water-Based Intumescent Firestop Sealant ODM-606 WATERBORNE FIRESTOP SEALANT is an ... |
 |
electronic potting compound supplier | Продавец: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | electronic potting compound supplier Ordovician Mind manufactures a comprehensive range of E... |
