Blind & Buried VIA PCB

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Custom blind and buried vias fabricationfrom professional and experienced pcb board supplier at low cost.

First of all, we start with traditional multi-layer boards. The structure of a standard multi-layer circuit board is a process including an inner layer line and an outer layer line, followed by drilling, and metallization in the hole to achieve the internal connection function of each layer line. However, due to the increase in line density, the way parts are packaged is constantly updated. In order to allow for a wider board area, more high-performance parts can be placed. In addition to the thinner line width, the aperture is also reduced from 1 mm in the DIP jack to 0.6 mm in SMD, and further reduced to 0.4 mm or less. However, the surface area is still occupied, so that there are buried holes and blind holes.

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