Type5 Sn42Bi57.7Ag0.3 Low Temperature Solder Powder
Product DetailsBBIEN LF-03 type5 Sn42Bi57.7Ag0.3 low temperature solder powderBBIEN Solder PowderSolder powders are the key component of all solder pastes.Pastes made with the same flux but with powders that differ in particle sizes often have different rheological/physical properties resulting in differences in screen/stencil printing,component placement and production yields.The powder constituent of solder paste,in fact,affects all stages of surface mount assembly from stability and printability of the paste,to the quality of the final fillet.BBIEN’s LF-03 type4 and type5 Sn42Bi57.7Ag0.3 solder powder is produced using only the highest quality virgin materials.All our powders exceed the J-STD-006 specificationSn42Bi57.7Ag0.3 Solder powder featureBBIEN low temperature Sn-Bi-Ag series solder powder products adopted:(1)We take Strictly alloy material manufacturing process,raw alloy materials had been fully homogenized.before atomizition.(2)Controlled by computer atomization technology process,It is ensured the solder powder from atomization atmosphere to have consistency and stability of quality.(3)The oxidation rate of Solder powder has been strictly controlled,It is made the total oxygen content below the Japanese industrial standard range,and the use of special surface packaging technology make solder powder surface form thin and strong protective film.Advantage for Sn-Bi-Ag solderpowder1) The Sn42Bi57.7Ag0.3 solder powder is ball shaped,the dark part is a tin rich area and the light part is a lead rich area.The pictures show the good sphericity,homogenous alloy composition and smooth surface of the product.2) Even particle size distribution:Particle size classification and final typing technology enables stable particle size of the product provided to customers.3) Low oxygen content:Oxygen content is strictly controlled during production and packing of allalloy welding powder.Leco oxygen determinator is adopted to determine the surface oxygen content and chemical assay is adopted to determine the total oxygen content.ParticlesThe Surface oxygen contentThe total oxygen contentType2(45-75um)≤120ppm≤0.08%Type2.3(38-63um)≤120ppm≤0.08%Type3(25-45um)≤120ppm≤0.08%Type4(20-38um)≤120ppm≤0.1%Type5(15-25um)≤180ppm≤0.15%Storage,Handling,and Shelf Life:Recommended optimum storage condition for solder powder to maintain consistent viscosity,reflow characteristics ,and overall performance.BBIEN’S SAC305 should be stabilized at room temperature prior to printing.BBIEN SAC305 should be kept at standard refrigeration temperatures,20~28°C.Please contact BBIEN,if you require additional advice with regard to storage and handling of this material.Shelf life is 6months from date of manufacture and held at 20~28°CParticle size for Sn-Bi-Ag series powderGrade1%Less Than90%10%Max.Type 3+45 microns25-45 micron(µm)25 microns(µm)Type 4+38 microns20-38 micron(µm)20 microns(µm)Type 5+25 microns15-25 micron(µm)20 microns(µm)Type 6+18 microns10-18 micron(µm)10 microns(µm)Type 7+25 microns5-12 micron(µm)5 microns(µm)Type4~type7<120 ppm micronsTechnical datasheet of Sn42Bi57.7Ag0.3 solder powderSpecificationSn42Bi35.7Ag0.3-type4,type5 powderAppearanceGray/black small size of powder on surfacePackingGeneral 5kg/bag;Chemistry component(Test Method:Titration Analysis+Spectrum Analysis)Elements Specification(%)Max Tested result(%WT)Sn 42.0±0.5 41.7709Al≤0.001 0.0001As≤0.030 0.0025Sb≤0.050 0.0020Bi Bal BalCu≤0.080 0.0004Fe≤0.020 0.0006Zn≤0.001 0.0004Ni≤0.010 0.0003Pb≤0.050 0.0257Cd≤0.002 0.0002Au≤0.050 0.0001Ag 0.2~0.4 0.3979Cd≤0.0020 0.0004Ge≤0.050 0.0003Mark:Storage at the room temperature≤25°C,humidity≤50%RH,Expiration date:6monthsImpulse Calefaction And Testing With MicroscopeOxygen Content:standard<0.0150,result is 0.0091;Shape:>90%(ANSI/J-STD-005 Spherical)Powder size Percentage:>45μm<0.00.00Analysis Method38~45μm<1.00.75PSD Analysis25~38μm20~25μm59.0640.19<20μm<10.00.00BBIEN's solder powder as followAlloy componentMeltingpoint℃SuggestingWorking temperature℃Gravity g/cm3Rigidity HBConduct heatM.S.KExtendMpaExtendrate%Conductivity%Sn42Bi58138~145100~2508.7711.66533Above 8016.6SNAlloy BrandSolidus TemperatureLiquidus TemperatureDensity g/cm3Available type size1Sn42Bi581391398.8Type3~type72Sn64Bi35Ag11511728.2Type3~type73Sn64.7Bi35Ag0..1Type3~type74Sn42Bi57.7Ag0..3Type3~type55Sn96.5Ag3.0Cu0..54Type3~type76Sn99Ag0.3Cu0..43Type3~type77Sn63Pb.4Type3~type78Sn62Pb36Ag.62Type3~type7Exporte countries:South Korea,Russia,America,Mid-east countries,Brazial,India,Thailand.Products Photos
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