HDI green solder mask OSP printed circuit board
HDI green solder mask OSP printed circuit board
green solder mask PCB,OSP printed circuit board
1)Thickness: 0.1mm-5mm
2)Minimum linewidth：0.075mm/3mil
3)Minimum gap：0.065/2.8mil
4)Minimum apertureinradium：0.15mm
5)Minimum aperture external diameter：0.45mm
6)Minimum BGA: 0.2mm
7)Layer：4 layers through hole non-impedance
All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
More information you can views here
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