Thermal Conductivity Tester (Heat Flow Method)，ASTM D5470 heat flow thermal conductivity measurement device

Whats/App: +86 156 1874 6768

Web: standard-groups.com

Thermal Conductivity Tester (Heat Flow Method) is a high-precision instrument designed for measuring the thermal resistance, thermal conductivity, and interface contact thermal resistance of thin heat conductors, solid electrical insulation materials, thermal grease, resins, rubber, beryllium oxide ceramics, and aluminum oxide ceramics. The device can test solid sheet materials directly, and with the use of a sample frame, it can also measure powdered and paste materials. The tester is designed and manufactured in full compliance with ASTM D5470-2017 standards and has benefited from over 20 years of production experience, ensuring reliability, mature performance, and high testing accuracy. The system features servo-controlled precise automatic pressing, automatic thickness measurement, 6-point temperature gradient detection, and computer-controlled fully automatic operation. The built-in thermal guard around the test rod reduces environmental temperature influence, allowing accurate measurements of thermal conductivity, thermal resistance, and interface contact thermal resistance under varying pressures and temperatures.

The instrument is widely used in universities, research institutions, quality inspection laboratories, and industrial production plants for material thermal property analysis.

Application

This tester is suitable for testing:

Thin heat conductors

Solid electrical insulation materials

Thermal greases, resins, and rubber

Beryllium oxide ceramics and aluminum oxide ceramics

Aluminum substrates, composite boards, and thermal pads

Typical applications include:

Academic research: Measurement of material thermal properties

Industrial quality control: Verifying thermal performance of production materials

R&D labs: Testing new thermal interface materials (TIMs)

Production sites: Monitoring and screening high-thermal-conductivity materials

Standards

The instrument complies with:

MIL-I-49456A – Insulating Sheet Material, Thermally Conductive Resin, Glass-Fiber Reinforced Thermal Materials

GB/T 5598-2015 – Method for Determining Thermal Conductivity of Beryllium Oxide Ceramics

GB/T 29313-2017 – Test Methods for Thermal Conductivity of Electrical Insulation Materials

ASTM D5470-2017 – Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials

Parameters

Item	Specification
Thermal conductivity range	0.01–50 W/m·K (standard), 5–500 W/m·K (high conductivity mode, automatic software switching)
Thermal resistance range	0.05–500 cm²·K/W
Sample size	Φ30 mm or 20×20 mm (standard); custom sizes: Φ15. Φ50. 25.4×25.4 mm
Sample thickness	0.001–50 mm (standard); typical 0.02–20 mm
Hot plate temperature range	Room temperature–99.99 °C (standard); optional 299.9 °C or 500 °C
Cold plate temperature range	0–99.99 °C; precision 0.01 °C (with high-precision low-temperature water bath)
Pressure range	0–1000 N; servo motor controlled; precision 0.1 N
Thickness measurement range	0–50 mm; resolution 0.001 mm; automatic
Sample quantity	1 piece (single or stacked layers)
Measurement accuracy	Thermal conductivity/thermal resistance ≤3%; contact thermal resistance ≤5%
Test modes	Thermal resistance under varying pressures; material thermal conductivity; contact thermal resistance at different pressures; aluminum/composite boards; aging reliability tests; high-conductivity materials; compression performance tests
Automation	Computer-controlled fully automatic measurement and report output
Power supply	220 V / 50 Hz; 1000 W

Features

High-precision measurement of thermal conductivity, thermal resistance, and interface contact thermal resistance

Automatic servo-controlled pressing and thickness measurement

6-point temperature gradient detection enhances measurement accuracy

Built-in thermal guard reduces environmental temperature influence

Suitable for both solid sheets and powder/paste materials

Fully computer-controlled with data recording and printing

Compatible with high-conductivity materials measurement using optional modules

Accessories

Main instrument

Analysis software (Chinese & English versions)

HX-1008 precision low-temperature constant temperature water bath (temperature control ±0.01 °C)

Calibration reference samples (2 pieces)

Sample accessories set (thermal grease, paste, powder test boxes, stamping molds for sheet samples)

Test Procedures

Prepare the sample according to specified size and shape. Solid sheets or stacked layers can be used; powder/paste requires a sample frame.

Place the sample between the hot and cold plates.

Set desired hot and cold plate temperatures via software.

Apply pressure using the servo-controlled mechanism.

Start the measurement; the system automatically records temperature gradients and thickness.

Wait for measurement completion; the software calculates thermal conductivity, thermal resistance, and contact thermal resistance.

Save and print results as required.

Maintenance Information

Keep hot and cold plates clean and free of residue.

Calibrate regularly using reference samples.

Inspect heat guards and pressure mechanisms for proper operation.

Maintain stable laboratory temperature to ensure measurement consistency.

Ensure proper water bath operation for cold plate stability.

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