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Chemical Mechanical Planarization Systems

Whats/App: +86 156 1874 6768

Web: standard-groups.com

Application

The Chemical Mechanical Polisher is widely used in laboratory and pilot-scale environments for polishing process optimization and material behavior studies, including:

Semiconductor wafer polishing (Si, GaN and related substrates)

Optical component surface finishing

Substrate and thin material planarization

Aerospace material surface preparation

Research on friction, wear, and material removal mechanisms

Typical test objects include semiconductor wafers, optical substrates, bonded pads, and development samples with diameters from 0.5 inch to 4.25 inches.

Standards

The system is primarily intended for research and development applications. It supports experimental setups and evaluation methods commonly referenced in:

(1) Semiconductor CMP process research practices

(2) Optical surface finishing and planarization studies

(3) Tribology and wear mechanism investigation methods

Specific test standards depend on user-defined processes and research objectives.

Parameters

ItemDescription
Load Control Closed-loop loading force control with high-precision force sensor
Torque Measurement High-resolution online torque measurement
Wafer Holder Self-leveling fixture with active rotation and horizontal oscillation
Sample Size Range 0.5 inch to 4.25 inches
Platform Fully automated XY platform with quick-change capability
Speed Control Wide adjustable speed range via programmable control
Slurry Delivery Automatic slurry delivery system
Inline Sensors Torque, temperature, and acoustic emission
Surface Measurement Integrated inline three-dimensional optical profiler

Accessories

(1) Self-leveling wafer fixture

(2) Quick-change wafer and pad holders

(3) Automatic slurry delivery system

(4) Inline torque sensor

(5) Acoustic emission sensor

(6) Online temperature monitoring module

(7) Integrated 3D optical profiler


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