Chemical Mechanical Polishing Equipment

Whats/App: +86 156 1874 6768

Web: standard-groups.com

Standards

The system is primarily intended for research and development applications. It supports experimental setups and evaluation methods commonly referenced in:

(1) Semiconductor CMP process research practices

(2) Optical surface finishing and planarization studies

(3) Tribology and wear mechanism investigation methods

Specific test standards depend on user-defined processes and research objectives.

Parameters

Item	Description
Load Control	Closed-loop loading force control with high-precision force sensor
Torque Measurement	High-resolution online torque measurement
Wafer Holder	Self-leveling fixture with active rotation and horizontal oscillation
Sample Size Range	0.5 inch to 4.25 inches
Platform	Fully automated XY platform with quick-change capability
Speed Control	Wide adjustable speed range via programmable control
Slurry Delivery	Automatic slurry delivery system
Inline Sensors	Torque, temperature, and acoustic emission
Surface Measurement	Integrated inline three-dimensional optical profiler

Features

Real-time measurement of friction coefficient during polishing

Precise control of loading force and rotational speed through closed-loop feedback

Integrated three-dimensional optical surface profiler for inline morphology analysis

Compatibility with multiple wafer and sample sizes

Online monitoring of torque, temperature, and acoustic emission signals for accurate endpoint detection

Accessories

(1) Self-leveling wafer fixture

(2) Quick-change wafer and pad holders

(3) Automatic slurry delivery system

(4) Inline torque sensor

(5) Acoustic emission sensor

(6) Online temperature monitoring module

(7) Integrated 3D optical profiler

Test Procedures

Mount the wafer or substrate using the appropriate quick-change fixture and ensure proper self-leveling.

Select a predefined test program or create a custom polishing program, setting load force, speed, and slurry flow.

Start the polishing process; the system automatically controls force and motion while delivering slurry.

Monitor real-time signals such as torque, temperature, and acoustic emission during polishing.

Use inline three-dimensional surface measurement to evaluate surface morphology and polishing progress.

Stop the test automatically or manually based on endpoint criteria or signal thresholds.

Maintenance Information

Clean wafer holders, polishing pads, and slurry delivery components after each test to prevent residue buildup.

Periodically verify calibration of force, torque, temperature, and acoustic emission sensors.

Inspect mechanical motion components and the XY platform to ensure smooth and accurate operation.

Keep optical components of the inline profiler clean to maintain measurement accuracy.

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