Benchtop Thermal Conductivity Tester (Heat Flow Method)
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Whats/App: +86 181 0160 0864
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Benchtop Thermal Conductivity Tester (Heat Flow Method) is a compact, high-precision testing system designed for measuring thermal conductivity, thermal resistance, and interfacial contact thermal resistance of thin thermally conductive and electrically insulating materials. The instrument is fully designed and manufactured in accordance with ASTM D5470-2017. utilizing the steady heat flow method combined with precise temperature gradient measurement. With automated servo-controlled loading, automatic thickness measurement, multi-point temperature detection, and computer-based control, the system enables accurate evaluation of material thermal performance under different pressures and temperatures while saving valuable laboratory space.
Application
The Benchtop Thermal Conductivity Tester is primarily used for thermal performance analysis of thin solid materials and interface materials, including:
Thin thermally conductive solids
Solid electrical insulation materials
Thermal interface materials, such as thermal grease, silicone grease, and resins
Rubber and elastomer materials
Ceramic materials, including beryllium oxide ceramics and alumina ceramics
Metal and composite substrates, such as aluminum substrates and copper-clad laminates
Standard testing is performed on solid sheet samples. With the use of optional frames and sample cells, powdered and paste materials can also be evaluated. The system is widely applied in universities, research institutes, quality inspection laboratories, and manufacturing facilities for material thermal analysis.
Standards
The instrument complies with and references the following international and national standards:
ASTM D5470-2017
Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials
MIL-I-49456A
Insulation Sheet Materials, Thermally Conductive, Resin-Based and Glass Fiber Reinforced
GB/T 5598-2015
Method for Determination of Thermal Conductivity of Beryllium Oxide Ceramics
GB/T 29313-2017
Test Method for Thermal Conductive Properties of Electrical Insulating Materials
Parameters
| Item | Specification |
|---|---|
| Thermal conductivity range | 0.01–50 W/m·K; 5–500 W/m·K (high-conductivity mode, automatic switching) |
| Thermal resistance range | 0.05–500 cm²·K/W |
| Sample size (standard) | Φ30 mm or 20 × 20 mm |
| Optional sample sizes | Φ15 mm, Φ50 mm, 25.4 × 25.4 mm (customized by contract) |
| Sample thickness range | 0.001–50 mm (typical: 0.02–20 mm) |
| Hot plate temperature range | Room temperature to 99.99 °C (standard) |
| Optional hot plate ranges | Room temperature to 299.9 °C / 500 °C |
| Cold plate temperature range | 0–99.99 °C |
| Cold plate control accuracy | 0.01 °C |
| Pressure range | 0–1000 N |
| Pressure control | Servo motor control, accuracy 0.1 N |
| Thickness measurement range | 0–50.00 mm |
| Thickness resolution | 0.001 mm |
| Number of samples | 1 piece (thin films or stacked layers supported) |
| Measurement error (thermal conductivity & resistance) | ≤3% |
| Measurement error (contact thermal resistance) | ≤5% |
| Test operation | Fully automatic computer-controlled testing |
| Power supply | AC 220 V / 50 Hz |
| Power consumption | 1000 W |
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