UV Laser Cutting Machine JG16
Laser Cutting Machine
Usage
The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc.
Feature
(1)Precision:
Adopting high-precision linear motor modules, servo control, Sizing Compensate, optical positioning and secondary positioning technologies.
(2)High quality
(a)little carbonization;
(b)high density graphics cutting.
(3)Highly intelligent, efficient
(a)With multi-panels cutting, auto-positioning, auto-correcting, automatically focus, automatic sizing compensation and exclusive cutting previews functions;
(b)JG16 use double working table to save time of feeding and blanking materials.
Parametres
|
Specification of href="" UV Laser Cutting Machine |
|
|
Model |
JG16 |
|
Wavelength |
355nm |
|
Laser Power |
Option (Standard10W) |
|
Laser Frequency |
30-120kHz |
|
Maximum Processing Size |
500mm x 400mm (Double platform） |
|
Maximum Operating Speed |
800mm/s |
|
Positioning Accuracy of Table |
±3μm |
|
Repetitive Positioning Accuracy of Table |
±1μm |
|
Total Accuracy |
±20um |
|
light spots |
20±5μm |
|
Scanning range |
45mmx45mm |
|
File Format |
*.gbr & *.dxf & *.lay |
|
Electric Power Supply |
AC220V/2kW；AC380V/5.5kW |
|
Dimensions(L x W x H) |
1850mmx1640mmx1650mm |
|
Weight |
2400kg |
|
Environmental Temperature |
20±2℃ |
|
Environmental Humidity |
≤60%RH,Non-condensing |
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Ground Amplitude |
≤5μm |
|
Ground Pressure |
≥1000Kgf/m2 |
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