Electronic Component Packaging Antistatic Foam Tray

CYG Tefa Co.,Ltd is one of the leading China electronic component packaging antistatic foam tray manufacturers and suppliers, welcome to wholesale electronic component packaging antistatic foam tray products from us.Quick DetailsPlace of Origin: Guangdong, China (Mainland)Brand Name: CYG----0051Plastic Modling Type: ExtrudingFeature: ESD / Anti staticsize: as requestsPackaging & DeliveryPackaging Details:packing as request or common packing with PE bagDelivery Detail:within two weeksSpecificationsHigh quality anti-static PE foam, ESD conductive IXPE foam roll High quality anti-static PE foam, ESD conductive IXPE foam rollSpecifications:1. Thickness ranging from 0.5mm to 100mm 2. Width is maximum (1500mm). 3. Length is custom-made.Conductive IXPE foam is produced by compounding PE with some special padding and foaming material, then cross linked by foaming.Conductive IXPE foam is produced by compounding PE with some special padding and foaming material, then cross linked by foaming. The conductivity IXPE foam is a hi-tech ESD product which has very good anti-static property, it is an ideal packing material for optoelectronic devices and microelectronics devices, integrated circuit, printed circuit board, communications, military products etc.Technical Index: NOItems dataCEP Series(conductive) DEP Series(Dissipative) 1ColorBlack2Density30-45KG/m33 surface Resistivity103-6 Ω/sq106-10 Ω/sq 4Volume Resistivity103-6 Ω·cm106-10Ω·cm 5Abrasive Potential<100V 6 Attenuation Half-time<1.0s7 Tearing strength>1.2N/mm8 Elongation>150%9 Tensile strength>0.5MPaFeatures:                                                                                                  1.excellent anti-static performance, surface resistivity and volume resistivity is very stable, at the same time, according to the customer requirement between adjusted2.Excellent ESD effect and long term anti-static function.3.with anti-static properties in not affect by environment or dry humidity4.environmental protection, non-toxic, no odor5.shockproof6.good performance: Cutting, adhesive processed into customer requirements of various shapes 25 IXPETechnical parameters of 40kg/m3 conductivity IXPE foam7.High temperature resistance: EPE,IXPE resists a maximum temperature of 120°C.8.Heat insulation, sound insulation, abrasion resistance; hard to lose and consume.9.Non-chemical corrosion :  free chemical corrosion to the electronic devices and the packing materials.10.Superior buffering and cushioning performance: independent and meticulous closed cell.Use and applications:1.The use of the aforementioned components, boards, modules packages, electronics, telecommunications industry:2.Applications in aviation, aerospace, communications, military ordnance and chemical industry.3.Advantage:1).It is an ideal substitute of traditional packaging materials. compared with traditional hollow board, conductive IXPE foam board is not only flexible and buffering,but also nontraumatic to electric devices and hands, while traditional hollow board is very easy to scratch electronic devices and hand in the process of use. The most important thing is that IXPE foam’s life is as several times longer as hollow boards.Compounded with antistatic, buffering and circulating properties, conductive IXPE foam trays for Hard Disks, Cell s, Motherboards and Memory Bar have irreplaceable advantages to the traditional injection molding trays, which make sure the maximum protection to those devices when circulating.2).Best service to you and delivery on time.Certification:We complied with SGS, ROHS ,ISO9001,UL international standards.  

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