Surface Mount Ceramic Packages for Electronic Devices
Sinopack provides miniaturized surface mount ceramic packages with cavity structures available . Hermetic or vacuum-sealing is typically applied to ensure device quality. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Fiber-Optic Communication Modules ceramic Packages with Submounts and Lids | Sinopack produces an extensive range of packages for use in fiber-optic communication modules --including ceramic submounts, packages, lids. Our pr... |
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25Gbps Cooled TOSA Ceramic Packages with lids | Box packaging style with ceramic and metal structure, TEC attachable Structure. High frequency used for 100Gbps 10km/40km. Low Return Loss: -15dB m... |
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Sinopack Standard Ceramic Packages with Lids for Device Evaluation | Sinopack offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP)... |
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Sinopack 40Gbps TOSA / ROSA Ceramic Packages for LR4 | TOSA / ROSA Packages for QSFP+ Transceivers, Surface Mount Packages, XLMD-MSA Compliant BTF PKG Sinopack devotes to the R&D and manufacturing o... |
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ALN / Alumina substrates for semiconductor laser diodes and photodiodes | Sinopack provides ceramic submounts for semiconductor laser diodes and photodiodes in fiber-optic communication modules. Both aluminum nitride (AlN... |
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