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XK-G60

Features

Thermalconductivity6.0W/mK

Lowthermalimpedance

Ultralowcompressionforce

Long-termreliability

Designforlowstressapplication

Applications

Automotiveelectronics

Comsumerelectronics

Telecommunications

Computerandperipherals

GLPOLY XK-G60 thermal gelis supplied in one component, andrequires mixing or curing, providing superior design flexibility.

Description

GLPOLY Thermal interface materials is the core to solve thermal management issue for 5G telecom devices. GLPOLY foresaw the development of 5G telecom several years ago and developed high performance thermal interface materials to solve the challenge.For instance, In July 2019, GLPOLY launched a thermal gel for sensitive electronic components targeting 5G technology, called XK-G60 thermal gel. This gel can be used for ethernet switches, optical transceivers, and routers. Now thermal gel XK-G60 was recognized by more and more customers.

Many suppliers said they could provide suitable thermal interface materials for 5G telecom equipment thermal management. Actually, most of them delivered low-end products that could not meet customers’ requirements. GLPOLY XK-G60 thermal gelwas verifief by many customers and was applied in volume production.

GLPOLY XK-G60 thermal gel provided proven reliability under high temperature aging test and high&low temperature thermal shock, performing stably in severe environment whether it’s winter or summer.

XK-G60 has a high thermal conductivity of 6.0W/mK, outstripping most of competitive products; low thermal resistance and ultrathin bondline thickness help transfer heat rapidly. It is compatible with high volume, automated dispense processes, eliminating time consuming hand assembly. This material deflects under low compressive forces, decreasing stress on dedicate component thus decreasing component failure.

GLPOLY imported automated production lines to improve production efficiency, eliminates artificial error and keep product consistency.

GLPOLY thermal gel XK-G60 has features and benefits as following:

1. High thermal conductivity 6.0W/mK;

2. Deforms in low compression force, decreasing stress on component, thus decreasing component failures;

3. Wet-out interface, dcreasing contact thermal resistance;

GLPOLY thermal gel was applying to 5G telecom equipment, drone, automotive electronics, auto pilot and smart. Partnered with DT Mobile,LG, GAC New Energy, Farasis Energy, Lixiang Motor, NIO Automotive and more, GLPOLY delivered technological solution and superior service.

GLPOLY is ready to help you solve thermal management challenge with advanced thermal interface materials and superior service.

GLPOLY XK-G60 thermal gelis a highperformance, one componet packagedgap filling material withadvantages and benefits:

1. Easily dispensed, non-curing, wetting out interface, decreasing contact thermal resistance;

2. Particle size is as small as 1μm, filling rate is 20%higher than that of peers’;

3. Supplied in one-component, decreasing purchasing and logistics complexity;

4. Compatible with high volume, automated dispense processes, accomodates a variety of bondline thickness;

5. Deforms under low pressure, decreasing stress on component thus decreasing component failures;

6. Proven reliability in extreme temperature cycling and thermal shock;

GLPOLY thermal gel deflects under low compressive force, wetting out surface for decreasing contact thermal resistance. This materialcan be dispensed easily, and is compatible with high volume, automated dispense processes.



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