Sunkye R04S Space Grade Micro D Solder Cup Type Connector
Micro-D Sub Connectorsfor space applications.
Twist pin contacts, high density interconnection, 1.27mm contactspacing and 1.1mm spacing between rows.
Contacts:9,15,21,31,37, A51,51,69,100pins.
Brief Introduction of Sunkye R04S Space Grade Micro D Solder Cup Type Connector
Product feature:small and light, antivibration etc. high performance.
The solder cup can mate with AWG26 and AWG28 wire.
Meet space applications.
Material and Finish of Sunkye R04S Space Grade Micro D Solder Cup Type Connector |
||
ltem |
Material |
Finish |
shell |
Aluminum alloy |
Electroless nickel plating |
insulator |
20%FPPS |
- |
seal ring |
Silicone rubber |
- |
contacts |
copper alloy |
gold plating |
locking hardware |
stainless steel |
passivation |
backshell |
Aluminum alloy |
Electroless nickel plating |
Electrical Performance of Sunkye R04S Space Grade Micro D Solder Cup Type Connector |
||
Performance |
Marking |
Rating Value |
Current rating(max) |
I |
3A (24#),13A(16#) |
Dieletric withstanding voltage(sea level) |
U |
800 Vr.m.x(50Hz) |
Contact resistance |
R |
≤10mΩ (24#),≤5mΩ (16#) |
Insulation resistance(500VDS,sea level) |
R |
≥5000MΩ |
Specification of Sunkye R04S Space Grade Micro D Solder Cup Type Connector |
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Environment: -55℃ ~+125℃ |
Contact resistance:≤ 21mΩ |
/ |
Vibration: 10Hz~ 2000Hz, 294m²/s |
Insulation resistance:≥5000MΩ 100VDC |
/ |
Shock: 980m/s² 6ms |
Dielectric strength: 250V |
EIA-364-28, test condition IV |
Rated current: 1A |
Machine life: 200 times |
/ |
Random vibration: Power spectral density O.4G²/Hz, root mean square value of total acceleration 23.1G |
EIA-364-27, test condition E |
|
Salt spray |
96h |
EIA-364-26, test condition B |
Humidity |
240h |
ElA-364-31, test condition IV |
Thrmal shock |
-55℃ ~+125℃ |
EIA-364-32, test condition IV |
Contact engaging and separating force |
/ |
|
Irradiation resistant |
Total dose:1X105Gy |
/ |
hermal vacuum outgassing |
TML≤1%, CVCM≤0.1% |
/ |
Magnetic permeability |
200 gamma |
/ |
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