Sunkye R04S Space Grade Micro D Solder Cup Type Connector
Micro-D Sub Connectorsfor space applications.
Twist pin contacts, high density interconnection, 1.27mm contactspacing and 1.1mm spacing between rows.
Contacts:9,15,21,31,37, A51,51,69,100pins.
Brief Introduction of Sunkye R04S Space Grade Micro D Solder Cup Type Connector
Product feature:small and light, antivibration etc. high performance.
The solder cup can mate with AWG26 and AWG28 wire.
Meet space applications.
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Material and Finish of Sunkye R04S Space Grade Micro D Solder Cup Type Connector |
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ltem |
Material |
Finish |
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shell |
Aluminum alloy |
Electroless nickel plating |
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insulator |
20%FPPS |
- |
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seal ring |
Silicone rubber |
- |
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contacts |
copper alloy |
gold plating |
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locking hardware |
stainless steel |
passivation |
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backshell |
Aluminum alloy |
Electroless nickel plating |
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Electrical Performance of Sunkye R04S Space Grade Micro D Solder Cup Type Connector |
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Performance |
Marking |
Rating Value |
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Current rating(max) |
I |
3A (24#),13A(16#) |
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Dieletric withstanding voltage(sea level) |
U |
800 Vr.m.x(50Hz) |
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Contact resistance |
R |
≤10mΩ (24#),≤5mΩ (16#) |
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Insulation resistance(500VDS,sea level) |
R |
≥5000MΩ |
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Specification of Sunkye R04S Space Grade Micro D Solder Cup Type Connector |
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Environment: -55℃ ~+125℃ |
Contact resistance:≤ 21mΩ |
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Vibration: 10Hz~ 2000Hz, 294m²/s |
Insulation resistance：≥5000MΩ 100VDC |
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Shock: 980m/s² 6ms |
Dielectric strength： 250V |
EIA-364-28, test condition IV |
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Rated current: 1A |
Machine life： 200 times |
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Random vibration: Power spectral density O.4G²/Hz, root mean square value of total acceleration 23.1G |
EIA-364-27, test condition E |
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Salt spray |
96h |
EIA-364-26, test condition B |
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Humidity |
240h |
ElA-364-31, test condition IV |
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Thrmal shock |
-55℃ ~+125℃ |
EIA-364-32, test condition IV |
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Contact engaging and separating force |
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Irradiation resistant |
Total dose:1X105Gy |
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hermal vacuum outgassing |
TML≤1%, CVCM≤0.1% |
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Magnetic permeability |
200 gamma |
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