Epoxy potting adhesives WOCC-AHF/WOCC-BHF
■ Description
Two-component encapsulating system based on epoxy resin,formed from auxiliaries including low-halogen epoxy resin, low-halogen diluent, Aluminum hydroxide, compound anhydride, cross-linking agent and defoamer by special production processing.
Excellent of the surface gloss of the cured epoxy resin, hight temperature and humidity resistance is good excellentelectrical properties and have flame retardant property.
■ Applications
Encapsulation of electrical components of Capacitor, Igniter, Transformer, trigger and Filter.
■ General properties
|
Test Item |
Test Mothed/Conditions |
WOCC-AHF |
WOCC-BHF |
|
Appearance |
Visualization |
All color viscous liquid |
Slight yellow transparent liquid |
|
Density |
25º C g/m³ |
||
|
Viscosity |
40º C mpa.s |
1000 - 5000 |
20 - 45 |
|
Viscosity(blended) |
40º C mpa.s |
300±150 |
|
|
Storage validity |
Sealed and storage Temp.below 25º C |
12 months |
12 months |
|
Ratio of blend |
Weight/Weight |
100 |
30-38 |
|
Curing condition |
º C/hrs |
90 º C/1h |
|
■ Characteristics after curing
|
Item |
Unit/Conditions |
WOCC-AHF/ WOCC-BHF |
|
Hardness |
20º C Shore-D |
≥80 |
|
Hardness |
70º C Shore-D |
≥73 |
|
Insulation Strength |
25º C kv/mm |
≥18 |
|
Bending Strength |
Kg/cm2 |
≥81 |
|
Heat/cold Shock Resistance |
-20 to 120º C |
Cycle times: more than 5 |
|
Flame Retardancy |
UL 94 |
V0 or V1 |
|
Surface Resistance |
25º C Ω.cm |
＞1013 |
|
Volume Resistance |
25º C Ω.cm |
＞1014 |
|
Curing Shrinkage Rate |
% |
＜0.6 |
|
Tg |
º C |
≥90 |
|
Cl |
ppm |
≤900 |
■ Storage, Packaging
- Sealed and storage Temperature below 25º C after each operation
- Please see the term of validity in each packages
- Packages: A component is 25kg, B component is 10kg or 25kg
- The storage validity is 12 months, a little precipitate shall be occurred provided high temperature. Please stir the material before using.
Note: The above data was tested under the conditions of 70% humidity and 25º C Temperature, This is for your reference only.
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