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Epoxy potting adhesives WOCC-AHF/WOCC-BHF

Description

Two-component encapsulating system based on epoxy resin,formed from auxiliaries including low-halogen epoxy resin, low-halogen diluent, Aluminum hydroxide, compound anhydride, cross-linking agent and defoamer by special production processing.

Excellent of the surface gloss of the cured epoxy resin, hight temperature and humidity resistance is good excellentelectrical properties and have flame retardant property.

Applications

Encapsulation of electrical components of Capacitor, Igniter, Transformer, trigger and Filter.

General properties

Test Item

Test Mothed/Conditions

WOCC-AHF

WOCC-BHF

Appearance

Visualization

All color viscous liquid

Slight yellow transparent liquid

Density

25º C g/m³

Viscosity

40º C mpa.s

1000 - 5000

20 - 45

Viscosity(blended)

40º C mpa.s

300±150

Storage validity

Sealed and storage Temp.below 25º C

12 months

12 months

Ratio of blend

Weight/Weight

100

30-38

Curing condition

º C/hrs

90 º C/1h

Characteristics after curing

Item

Unit/Conditions

WOCC-AHF/ WOCC-BHF

Hardness

20º C Shore-D

80

Hardness

70º C Shore-D

73

Insulation Strength

25º C kv/mm

18

Bending Strength

Kg/cm2

81

Heat/cold Shock Resistance

-20 to 120º C

Cycle times: more than 5

Flame Retardancy

UL 94

V0 or V1

Surface Resistance

25º C Ω.cm

1013

Volume Resistance

25º C Ω.cm

1014

Curing Shrinkage Rate

%

0.6

Tg

º C

90

Cl

ppm

900

Storage, Packaging

  1. Sealed and storage Temperature below 25º C after each operation
  2. Please see the term of validity in each packages
  3. Packages: A component is 25kg, B component is 10kg or 25kg
  4. The storage validity is 12 months, a little precipitate shall be occurred provided high temperature. Please stir the material before using.

Note: The above data was tested under the conditions of 70% humidity and 25º C Temperature, This is for your reference only.



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