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HDI PCB, High Density Interconnect PCB, HDI PCB Manufacturing

High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.MOKO maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.HDI Board General InformationHigh Density Interconnects (HDI) board are defined as a board (PCB) witha higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (<400 µm), I/O>300,   and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.According to layer up different, currently DHI board is divided into three basic types:1) HDI PCB (1+N+1)HDI PCB, High Density Interconnect PCB Features: Suitable for BGA with lower I/O counts Fine line, microvia and registration technologies capable of 0.4 mm ball pitch Qualified material and surface treatment for Lead-free process Excellent mounting stability and reliability Copper filled viaHDI PCB, High Density Interconnect PCB Application: Cell , UMPC, MP3 Player, PMP, GPS, Memory Card1+N+1 HDI PCB Structure:2) HDI PCB (2+N+2)HDI PCB, High Density Interconnect PCB Features: Suitable for BGA with smaller ball pitch and higher I/O counts Increase routing density in complicated design Thin board capabilities Lower Dk / Df material enables better signal transmission performance Copper filled viaHDI PCB, High Density Interconnect PCB Application: Cell , PDA, UMPC, Portable game console, DSC, CamcorderHDI PCB CapabilitiesItemCapabilitiesLayers3 - 50 LayersHDI Step3+N+3Min.Line Width0.05mm (2 mil)Min.Line Space0.05mm (2 mil)Min.Annular ring0.1mm (4 mil)Min. Via0.1mm (4 mil)Max.Size500mm X 800mmMaterialFR4,High Tg220Material thicknessStart at 25um Plus copperCopper thickness0.3 OZ to 10 OZ (10um - 350um)Please contact us for more information about HDI PCB Board.


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