Slitong ceramicPCB
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Ceramic circuit board | 基板名称：其他陶瓷PCB基板材料厚度：3mm 导电层：Cu 金属层厚度：100μm 表面处理：OSP 金属单面/双面：双面 镀铜通孔：无 阻焊：无 |
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Ceramic base | style="vertical-align: inherit;">微信：yjqp3344 |
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Ceramic substrate manufacturers | 产品特点：陶瓷电路板精度高，具有良好的电气和热性能。2。陶瓷电路板具有较高的结合强度和良好的焊接性，可以实现盲孔。3。陶瓷电路板技术成熟，环保，无污染，成本低于传统技术4.应用广泛，可以生产单面和双面三维陶瓷电路板5.定制生产，无需开模，生产周期短6.没有有机成分，耐宇宙辐射，在航空和太空中具... |
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Aluminum Nitride (AlN) | 氮化铝（ALN）是微电子行业中常用的材料。典型的用途包括中到高功率的DC / RF /微波电路。的AlN具有与硅类似的高导热率和低热系数。氮化铝在电路中的散热能力可确保适当的电路功能，提高可靠性并延长两次故障之间的平均时间。的AlN具有很高的抗热震性，并且与正常的半导体工艺，化学物质或气体不反... |
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Thermal conductive ceramic substrate | 电子封装要求基板材料满足高绝缘性，低介电常数，并且芯片具有热膨胀系数，良好的加工性能，较高的机械强度要求。由于陶瓷基板系数的特性，在电子封装应用（例如LED，CPV和绝缘栅双极型晶体管）中，良好的调谐性，耐热性，绝缘性和芯片匹配的热膨胀性被激光二极管封装得到了更广泛的应用。通过LED照明和传感... |
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