1.0-7.0 W/m·K silicone Thermal putty for heat sink computer services
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Product Features
Bornsun's BN-PN series (thermal putty) are mud-like thermal materials whose form is between thermal pad and thermal grease.
Thermal putty could be shaped into required thickness and size by hand or mold. It could be still soft and deformable after using. BN-PN series thermal putty will not get cured which meets your demands of reapplying and repair of components.
In conjunction with outstanding compression characteristics (up to 80%), thermal Putty BN-PN series has a high thermal conductivity that results in very low thermal resistance. It’s naturally adhesive and requires no further adhesive coating which allows it to be applied at various complicated circumstances.
Thermal putty is electrically insulating and is stable from -60°C to 200°C.
ROHS Compliant: Yes
Features
Thermal conductivity: 1.0-7.0 W/m·K
Excellent thermal performance
Low thermal resistance
Non-toxic, non-corrosive
Electrically insulating
Excellent deformability
Application
LED
Uneven surface components
Between semiconductor and heat sinks
Electronics
Packaging Description
BN-PN series(thermal putty) is available in:
Cans （1Kg，2Kg）
Buckets （10Kg，20Kg）
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