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Liquid Solder Flux

Product DetailsBBIEN LF-01 Liquid solder fluxIntroduction for BBIEN liquid LF fluxBBIEN LF-01 flux is a weak-halide activated foam flux conforming to with non-corrosive residues .BBIEN LF-01 liquid solder flux is a ready to use foam flux for wave soldering machines and has been specially formulated for applications in the electronic industry for soldering of printed circuits. The residues on printed circuit boards are dry and fast to handle immediately after the soldering process. During circuit testing test needles do not get clogged, so that cleaning of the boards is not required.Classification for solder fluxBBI-LF-01 no clean soldering flux belongs to 2-Propanol types of flux,which is using for wave soldering using flux. Special design to meet the wettability for wave soldering. Bright spot welding. Flux in the appropriate internal activity solid content and its mechanism ensure the little residue after welding circuit,and board surface drying, cleaning. In un-specificness conditions,it exempt cleaning process,then save the operating costs of manufacture. It has with excellent welding performance. For wave soldering can reduce bridge or other defects.FEATURESExhibits exceptional electrical reliability for a low-solids wave soldering flux. Complies with IPC-J-STD-004 SIR, Bellcore SIR, Bellcore ECM, JIS ECM, and JIS SIR.Thermally stable activators provide minimized solder bridging in a low-solids, no-clean flux for wavesoldering and Selective Soldering in lead-free and tin-lead applications.Reduces the surface tension between solder mask and solder to resist solder ball formation.Very low level of non-tacky residue to reduce interference with pin testing. Exhibits no visible residues.• Low solid content• Welding spot surface brightness• High wettability• Non-cirrisuveness• No residue generates after welding and no need to clean• According with ANSI/J-STD-004• High surface insulation resistance, and not obviously decreasedApplicationDuring the soldering process most of the flux is rinsed off the PCBs. Should cleaning be desired, the remaining flux residues can be easily removed using an alkaline cleaner. All known cleaning processes, such as by brushing, ultrasonic, steam etc. are appropriate. Evaporation of solvent can change the composition. Evaporation causes an increase of solid content and therefore density increases.HANDLING• Sealing save time for 1 year, do not cryopreservation this product.• Away from fire, avoiding direct sunlight or hyperpyrexia.• Without stirring before using.• Do not use residual flux and flux, keep container sealing hybrid packaging.• Before using the flux which be long-term storage, proportion shall be measured,and adding thinners to adjust to the normal proportion.BBIEN LF-01 liquid using tipsProjectSuggest parametersFlux coated (Spray method)750-1500mg/in2  Solid contentSurface of board preheated temperature110-160°CUnder the board the preheated temperatureAbout 35°C higher than surfaceBoard heating rateMax 2°C/sTilt angle of conveyor belt5-7°, in general 5.7-6°Speed of conveyor belt1.0-1.5 m/min,in general 1.2 m/minWave crest of time1.5-3.5s,in general 2.0-2.5sTin stove temperature220-280°CNote:BBIEN LF-01 soldering flux is apply for wave soldering technique. The above parameters for reference only,don't guarantee to obtain the best welding effect. As the different conditions of the equipment, components, PCB aspects of user, user had better use experimental design method to obtain the optimum parameters.Main technical data of fluxPROCESS CONTROLIn the process of using soldering flux control is very important,it can guarantee the composition of flux not change. Wave soldering process accurate control of flux can not only ensure the same welding effect, but also residuel at least after welding . Then to eliminate scratching of the test of solder probe.Health & Safety:This product, during handling or use, may be hazardous to health or the environment. Read the Material safety Data Sheet and warning label before using this product.Consult the SDS for all safety information. The most recent version of the SDS is available from BBIEN. Inhalation of the flux solvent and volatilized activator fumes, which are generated at soldering temperatures, may cause headaches, dizziness and nausea. Suitable fume extraction equipment should be used to remove the flux from the work area. An exhaust at the exit end of the wave solder machine may also be needed to completely capture the fumes. Observe precautions during handling and use.Suitable protective clothing should be worn to prevent the material from coming in contact with skin and eyes.BBIEN LF-01liquid flux contains a highly flammable solvent with a flash point of 53°F (12°C). The flux must not be used near open flames or near non-flameproof electrical equipment.Packing DetailsBBIEN liquid solder flux is package with plastic drum/bucket.General  each drum/bulket can hold 20L/16kgSpecial small packing such as 5kg,8kg please consult for BBIEN.Exported countries:BBIEN LF-01 lead free liquid solder flux have been exported to Bangladesh, Hongkong, SouthKorea, Russia, Japan, India…We are appreciated your kindly feedback and inquiries.Products PhotosTechnical DatasheetTechnical data information for BBIEN LF-01 iquid solder fluxBBIEN LF-01 no clean soldering flux Physical properties ProjectTest resultsAppearanceColorless, clear fluidSmellAlcohol tastePhysical stabilityBy:5±2 ºC No layered or crystallization precipitation,45±2 ºC no layering phenomenonSolid content(3%~6%) 6%Proportion0.80± 0.05Acid value19.2 ± 1.0 mgKOH/gHalogen contentNo·   Reliability performanceProjectTechnical requirementsTest resultWater extract resistivityJIS Z3197-86JIS Z3283-86By:5.0×104 ohm·cmBronze corrosionIPC-TM-650 2.3.32PassAgCrO4IPC-TM-650 2.3.33PassHalogen contentJIS Z3197-86JIS Z3283-86PassBoiling point81-120℃Buring Point>250℃(300-400℃)PH6ColorColorless/light yellowGravity0.82BBIEN LF-01 wave solder flux composition1.Flux ProductProduct name:Wave lead free soldering fluxMSDS code:MSDS BBI-218Product usage:Wave soldering using flux,Used in electronic industry2. COMPOSITION / INFORMATION ON INGREDIENTSCompositionCAS #HS codePercentage Composition(wt%)OSHA PELmg/m3TLV-TWAmg/m3TLV-STELmg/m32-PropanolRosinN.E.N.E.N.E.Solder flux chemical properties 9.PHYSICAL AND CHEMICAL PROPERTIESAppearance(20 °C)LiquidSpecific gravity (water = 1 at 25 °C)0.80±0.05Boiling point (760 mm Hg)82°C (179.6°F)Melting pointNoEvaporative press (mm Hg at 20 °C)33Volatile rate (butyl acetate = 1)2.3 - IPASteam density (air = 1)2.07(IPA)Volatile volume percentage97%Water solubility(% by weight)98The volatile organic compounds (VOC)NOPH5.6Smell threshold<43- IPAFreezing point (760 mm Hg)NoW/O distribution coefficientNoColors and smellColorless, alcoholsFLUX APPLICATION BBIEN LF-01 wave liquid solder flux is formulated to be applied by spray methods. A uniform coating of flux is essential to successful soldering. When spray fluxing, the uniformity of the coating can be visually checked by running a piece of pH sensitive paper matching the footprint of the assembly over the spray fluxer.OPERATING PARAMETERSAC305 / SACX030763/37 Sn-PbAmount of Flux Single Wave:applied by Spray1200 – 1800 µg/in²(190 - 280 µg/cm² ) of solids1000 – 1400 µg/in²(155 – 220 µg/cm² ) of solidsAmount of Flux Dual Wave:applied by Spray1600 – 2000 µg/in²(250 – 310 µg/cm²) of solids1500 – 1800 µg/in²(230 – 280 µg/cm² ) of solidsTopside Preheat Temperature105°C – 120°C (221°F – 248°F)75°C -100°C (167°F - 212°F)Bottom side PreheatTemperatureabout 35°C (95°F) higher than topsideabout 35°C (95°F) higher than topsideMaximum Ramp Rate ofTopside Temperature (to avoidcomponent damage)2°C/second maximum2°C/second maximumConveyor Angle4°- 7° (6° typical)4°- 7° (6° typical)Conveyor Speed3 - 6 ft./min. (0.9 – 1.8 m./min.)3 - 6 ft./min. (0.9 - 1.8 m./min.)Contact Time in the Solder(includes Chip Wave andPrimary Wave)1.5 - 3.5 seconds(2.5 - 3 seconds most common)1.5 - 3.5 seconds(2.5 - 3 seconds most common)Solder Pot Temperature255°C – 265°C (491°F – 509°F)240°C - 250°C (464°F – 482°F)These are general guidelines, which have proven to yield excellent results; however, depending upon your equipment,components, and circuit boards, your optimal settings may be different. In order to optimize your process, it is recommended to perform a designed experiment, optimizing the most important variables (amount of flux applied, conveyor speed, topside preheat temperature, solder pot temperature and board orientation).Advantage And ServiceBBIEN LF-01 liquid solder flux1) BBIEN’s liquid is used for Sparkle Solder [Sn-Pb] series and lead free wave soldering process.2) Our comprehensive set of soldering technologies support the advance of the high-tech industries.3) It is said that electronic devices start with jointing and end with jointing. A variety of jointing techniques have been developed for today's miniaturization and high density packing of electronic elements, but the role of soldering as the most universal and basic jointing remains the same.4) BBIEN’s  production lines are precisely designed to satisfy diversifying and sophisticated soldering requirements with such advanced products as the Sparkle Series and non-spattering odorless, high activity solders, to champion supporter of the world's electronic and other high-tech industries.5) Good performance for chip mounted & high density boards, standard type.6) Prevention of dew condensation7) Chip mounted & high density boards, lower residue, spray coating after using fluxBBIEN liquid flux chemically removes oxide film from the to-be soldered metal surface, and the molten solder surface, thereby exposing solderable metal surfaces. Flux is therefore indispensable in all soldering processes, including PC board and special metals. It must possess the correct characteristics to meet specific application requirements. From BBIEN’s long experience, we have developed various types of flux, including PC board flux, all of which provide unrivaled performance.Technical Advantage1) BBIEN can share the datasheet for our product to our clients.2) Some certificate of compliance,SGS,ISO and COA,MSDS,are available.3) BBIEN appreciate our clients and your valuable advice and suggestion,which will make our product and company better and better.4) Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully, quickly,technical support is available.Shipping Advantage1) Mutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety ,quickly and efficiently.2) Shipment can be deliveried once placing order 2 to 10 working days.3) Shipment will be regular and normal go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.Service1) When you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours. And solve your problem on solder products.2) OEM is available according to your own logo.Payment way:A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.BBIEN also do some return back for our society


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