Multifunctional Rapid Thermal Conductivity Tester (TPS & Hot Disk Method)，Benchtop High-Precision Material Thermal Conductivity Tester

Multifunctional Rapid Thermal Conductivity Tester (Integrated Unit) is a high-precision instrument based on the Transient Plane Source (TPS) method, utilizing a Hot Disk probe. It measures thermal conductivity, thermal diffusivity, specific heat, heat storage coefficient, and thermal resistance of solid, powder, liquid, paste, coating, thin-film, insulation, and anisotropic materials.

The instrument provides rapid and accurate testing, avoiding contact resistance errors inherent in steady-state methods. Minimal sample preparation is required; solid materials only need a relatively flat surface. The tester supports various test protocols and mathematical models for different material types, offering broad applicability, fast testing, and reliable results.

Reference standards: ISO 22007-2:2015. GB/T 32064-2015.

Application

The tester is widely used for thermal characterization of:

Metals, alloys, and graphite

Thermal pastes, silicone, and rubber

Ceramics and composite ceramic materials

Polymers, paper, fabrics, foams, and insulation materials

Concrete, composite panels, and paper honeycomb structures

Anisotropic materials

Typical applications include:

Rapid thermal property testing in R&D and quality control laboratories

Characterization of high and low conductivity materials

Evaluation of thermal behavior in powders, pastes, liquids, coatings, and thin films

Thermal analysis of construction, aerospace, electronics, and insulation materials

Standards

ISO 22007-2:2015 – Determination of Thermal Conductivity and Thermal Diffusivity of Solids by Transient Plane Source (TPS) Technique

GB/T 32064-2015 – Thermal Conductivity Test Method Using Transient Plane Source (TPS) Technique

Parameters

Item	Specification
Thermal conductivity range	0.001–500 W/(m·K); resolution 0.0001 W/(m·K)
Thermal diffusivity range	0.1–100 mm²/s
Heat storage coefficient	0.1–30 W/(m²·K)
Specific heat	0.1–5 kJ/(kg·°C)
Thermal resistance	0.5–0.000005 mm²·K/W
Temperature measurement accuracy	≤0.0001 °C
Measurement relative error	≤3%
Repeatability error	≤3%
Test duration	1–120 seconds
Sample environment temperature	-40–150 °C (standard); optional -50–250 °C, vacuum environment available
Probe diameter	Standard Φ15 mm; optional Φ30 mm, Φ15 mm, Φ7.5 mm, Φ4 mm
Sample types	Solid blocks, powders, pastes, liquids, coatings, thin films, insulation materials, anisotropic materials
Automation	Full software-controlled measurement, parameter analysis, and report output
Power supply	AC 220 V ±10%, 50/60 Hz; total power <500 W
Form factor	Integrated compact unit, desktop installation

Features

Rapid measurement: 1–120 seconds testing time saves significant laboratory time.

No contact resistance influence: TPS method avoids errors from contact resistance in steady-state methods.

Minimal sample preparation: Solid samples require only a relatively flat surface; powders, pastes, and liquids are easily accommodated with specialized test holders.

Versatile testing: Supports thin materials, high thermal conductivity (100–500 W/m·K), low conductivity insulation (0.010–0.050 W/m·K), and anisotropic materials.

Full automation: Software-controlled testing, data analysis, and report generation.

Compact design: Integrated unit saves space and allows easy installation.

Accessories

Main instrument

Analysis software (Chinese & English versions)

Two quartz reference samples

Accessory kit: paste, powder, and liquid test holders; sample fixture for solid materials

Test Procedures

Prepare the sample according to its state: solid, powder, paste, liquid, or thin film. Solid samples require a relatively flat surface.

Place the Hot Disk probe on or within the sample. Use the appropriate fixture for powders, pastes, or liquids.

Configure test parameters via the software, including probe diameter, temperature, and material type.

Start the test; the software records temperature changes over time.

Software calculates thermal conductivity, thermal diffusivity, specific heat, heat storage coefficient, and thermal resistance.

Review data and generate the report.

Maintenance Information

Keep the Hot Disk probe clean and free from residues.

Calibrate periodically using quartz reference samples.

Check the integrity of sample holders and fixtures before each test.

Maintain a stable laboratory environment to ensure measurement accuracy.

Store the instrument in a dry environment to protect electronic and thermal components.

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