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Benchtop Thermal Conductivity Tester (Heat Flow Method)

Whats/App: +86 156 1874 6768

Web: standard-groups.com

Benchtop Thermal Conductivity Tester (Heat Flow Method) is a compact, high-precision testing system designed for measuring thermal conductivity, thermal resistance, and interfacial contact thermal resistance of thin thermally conductive and electrically insulating materials. The instrument is fully designed and manufactured in accordance with ASTM D5470-2017. utilizing the steady heat flow method combined with precise temperature gradient measurement. With automated servo-controlled loading, automatic thickness measurement, multi-point temperature detection, and computer-based control, the system enables accurate evaluation of material thermal performance under different pressures and temperatures while saving valuable laboratory space.

Application

The Benchtop Thermal Conductivity Tester is primarily used for thermal performance analysis of thin solid materials and interface materials, including:

Thin thermally conductive solids

Solid electrical insulation materials

Thermal interface materials, such as thermal grease, silicone grease, and resins

Rubber and elastomer materials

Ceramic materials, including beryllium oxide ceramics and alumina ceramics

Metal and composite substrates, such as aluminum substrates and copper-clad laminates

Standard testing is performed on solid sheet samples. With the use of optional frames and sample cells, powdered and paste materials can also be evaluated. The system is widely applied in universities, research institutes, quality inspection laboratories, and manufacturing facilities for material thermal analysis.

Standards

The instrument complies with and references the following international and national standards:

ASTM D5470-2017

Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials

MIL-I-49456A

Insulation Sheet Materials, Thermally Conductive, Resin-Based and Glass Fiber Reinforced

GB/T 5598-2015

Method for Determination of Thermal Conductivity of Beryllium Oxide Ceramics

GB/T 29313-2017

Test Method for Thermal Conductive Properties of Electrical Insulating Materials

Parameters

ItemSpecification
Thermal conductivity range 0.01–50 W/m·K; 5–500 W/m·K (high-conductivity mode, automatic switching)
Thermal resistance range 0.05–500 cm²·K/W
Sample size (standard) Φ30 mm or 20 × 20 mm
Optional sample sizes Φ15 mm, Φ50 mm, 25.4 × 25.4 mm (customized by contract)
Sample thickness range 0.001–50 mm (typical: 0.02–20 mm)
Hot plate temperature range Room temperature to 99.99 °C (standard)
Optional hot plate ranges Room temperature to 299.9 °C / 500 °C
Cold plate temperature range 0–99.99 °C
Cold plate control accuracy 0.01 °C
Pressure range 0–1000 N
Pressure control Servo motor control, accuracy 0.1 N
Thickness measurement range 0–50.00 mm
Thickness resolution 0.001 mm
Number of samples 1 piece (thin films or stacked layers supported)
Measurement error (thermal conductivity & resistance) ≤3%
Measurement error (contact thermal resistance) ≤5%
Test operation Fully automatic computer-controlled testing
Power supply AC 220 V / 50 Hz
Power consumption 1000 W

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