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Fully Automatic Dual-Plate Thermal Conductivity Tester

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Web: qinsun-lab.com

Email:serving@qinsun-lab。com

Fully Automatic Dual-Plate Thermal Conductivity Tester (Guarded Hot Plate Method) is a precision instrument designed for thermal conductivity measurement of homogeneous and heterogeneous board materials. Based on unidirectional steady-state heat transfer principles, the instrument measures heat flux through the sample, the temperature difference between the upper and lower surfaces, and the sample thickness to calculate thermal conductivity.

Standards

The instrument complies with the following international and national standards:

GB/T 10294-2008 – Determination of Steady-State Thermal Resistance and Related Properties of Insulating Materials

GB/T 3399-1982 – Test Method of Thermal Conductivity for Plastics by Guarded Hot Plate Method

GB/T 10801.1-2002 – Measurement of Thermal Conductivity for Polyurethane Rigid Foam in Thermal Insulation

GB/T 10801.2-2002 – Measurement of Thermal Conductivity for Extruded Polystyrene Foam (XPS)

GB/T 3139-2005 – Test Method of Thermal Conductivity for Fiber Reinforced Plastics

GB/T 17794-2008 – Flexible Foam Rubber and Plastic Thermal Insulation Products

Parameters

ItemSpecification
Thermal conductivity range 0.001–3.000 W/m·K
Measurement accuracy ±2%
Repeatability ±1%
Hot plate temperature range Room temperature–150 °C (standard); optional up to 300 °C
Hot plate resolution 0.01 °C
Cold plate temperature range 0–60 °C (standard); optional -5–60 °C
Cold plate resolution 0.01 °C
Sample thickness 0–100 mm; resolution 0.001 mm; automatic measurement
Applied pressure 0–500 N; resolution 0.1 N
Sample size 300×300×(5–50) mm (standard); custom sizes available
Automation Fully computer-controlled testing and data processing
Test duration 60 minutes
Power supply 220 V / 50 Hz; 500 W

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