Sub-micron titanium carbide powder
Titanium carbide powder has high sintering activity and can be sintered densely at 1300-1500℃, which is 200-300℃ lower than the sintering temperature of alumina ceramics, thus saving energy costs. Compared with other ceramic powders (such as silicon carbide), it has better toughness, with a fracture toughness of up to 6MPa·m¹/², making it suitable for manufacturing structural ceramic parts. The powder can be made into granular form through spray drying, which is convenient for forming and processing. The density of the compact can reach more than 65% of the theoretical density. In the field of wear-resistant valves, ceramic valves made from this powder can withstand the erosion of high-pressure fluids and have a service life 20 times that of steel valves. This powder has excellent electrical and thermal conductivity, with an electrical conductivity of 3×10⁴S/m and a thermal conductivity of 35W/(m·K), and can be used to make conductive ceramics, heating elements, etc. After being compounded with copper powder, the resulting composite material features both high hardness and high electrical conductivity, making it suitable for manufacturing spark electrodes, with the electrode loss rate reduced to below 0.1%. The particle size distribution of the powder is narrow, and the ratio of D50 to D90 is less than 1.5, which can ensure the uniformity of the density of the formed green body and reduce the deformation after sintering. In the field of electronic packaging, it can be used to prepare high thermal conductivity packaging materials to solve the heat dissipation problem of chips
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