FR4 (Normal Tg, Mid Tg, High Tg)+ Roger Multilayer Printed Circuit Boards(PCB)
Multilayer printed circuit boards Layer:2-30L Material: FR4 (TG130, TG150, TG170, TG180)+ Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.30mm Surface Finish: ENIG, HASL, Immersion Tin/Sliver, OSP, Flash gold finger Finish Copper: 17μm-280μm
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PCBs with blind and buried vias | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... |
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Heavy Copper Printed Circuit Boards (PCB) | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... |
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4-Layer Flex-rigid Printed Circuit Boards(PCB) Prototyping Fabrication | 4-Layer Flex-rigid Printed Circuit Board Material: FR4+Polyimide Layer :4 |
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8-Layer Winding Coil Boards manufacturer (PCBs) | 8-layer winding coil boards Layer:8L Material: FR4 TG170 Thickness:2.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.3mm Surface Finish: ENIG ... |
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12-layer High Density Interconnector (HDI) Boards Exporter | 12-layer High Density Interconnector boards Thickness:0.8mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.1mm Surface Finish: ENIG+OSP |
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PCBs with blind and buried vias | Продавец: Hui Hexun Industrial (HongKong) Co., Ltd. | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Wi... |
