Black Color PCB Electronic Potting Silicone HY 215
TechnicalParametersforPCBElectronicPottingSilicone
Propertiesindex |
PartA |
PartB |
|
BeforeCuring |
Appearence |
Blackfluid |
Colorless/yellowishfluid |
Viscosisty(cps) |
2500500 |
- |
|
Featureswhenoperation |
MixingRatio(Byweight) |
10:1 |
|
OperatingTime(25C/min) |
20~30 |
||
Curingtime(hr,basicallycured) |
3 |
||
Curingtime(hr,perfectlycured) |
24 |
||
Hardness(shoreA) |
15+/-3 |
||
AfterCuring |
ThermalConductivity[W(mK)] |
0.4 |
|
DielectricStrength(kV/mm) |
25 |
||
Dielectricpermittivity(1.2MHz) |
3.0~3.3 |
||
Volumeresistivity(cm) |
1.01016 |
||
FireResistance |
94-V1 |
(PlsnotealldataofPCBElectronicPottingSiliconeRubberwithblackcoloraboveisin25Cwith55%humidityconditions.Wedon'tguaranteeasamedateiftestingunderdifferentconditions,orwhendatawasregenerated).
WarmTipsforforPCBElectronicPottingSilicone
1.Sealingpackageforstorage.Themixtureshouldbeusedupatoncetoavoidwasting.
2.Siliconebelongstonon-dangerousgoods,butkeepawayformmouthandeyes.
3.Whenitgetsstratifiedafteraperiodofstorage,PleasemixHY-210#evenlybeforeusing,
itdoesnotaffecttheperformance.
ShelfLifeandTransportation
1.Twelve(12)monthswhenstoredat25Cinoriginalunopenedpackages.
2.Thisisanon-dangerousproduct,itcanbetransportedasgeneralchemicals.
3.Productsexceedthestoragelifeshouldbeconfirmednormalbeforeusing.
TechnicalGuidelines
1.PlsputpartAandBinseparatecontainerandstirevenlybeforemixingthetwo
partstogether.
2.MixingRatiopartA:partBis10:1
3.Bubblereleaseifnecessary,deaerationthemixtureunder0.08MPafor3minutes.
4.HY-215#iscuredatroomtemperature,soplsputitunderroomtemperatureafter
pouring.Itcomestonextprocesswhenbasicallycured,andittakesabout24hours
forcompletelycured.
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