.

XK-G50

Features

Thermal conductivity 5.0W/mK

Low thermal resistance

Ultra thin bondline

Conforming with wet out

Design for low stress application

Applications

Automotive electronics

Comsumer electronics

Telecommunications

Computer and peripherals

Description

Title.png

XK-G50is a high performance, low thermalimpedance thermal gel.It accommodates a variety of different bondline thickness. This material can fillintrcate voids and gaps under low pressure. It requires no curing and mixing, providing desgin flexibility.

GLPOLY performance thermal gel has features and benefits:

1. Easily dispensed, non-curing, wetting out interface, decreasing contact thermal resistance;

2. Particle size is as small as 1μm, filling rate is 20% higher than that of peers’;

3. Supplied in one-component, decreasing purchasing and logistics complexity;

4. Compatible with high volume, automated dispense processes, accomodates a variety of bondline thickness;

5. Deforms under low pressure, decreasing stress on component thus decreasing component failures;

6. Proven reliability in extreme temperature cycling and thermal shock;

GLPOLY thermal gel can be dispensed easily, and is compatible with high volume, automated dispense processes.


GLPOLY thermal gel XK-G50 was designed to improve thermal management of 5G telecom modules.

XK-G50 thermal gel has been applying to 5G Telecom equipments of top class brands in bulk production and recognized by lots of thermal management engineers.

A lot of domestic competitors said they could provide high performance thermal gel for 5G telecom. Actually, it’s hard to find a suitable thermal gel for 5G modules. The thermal conducvity was lower than data marked on spec, or oil leakage exceeded permitted levels etc., all fake data would be disclosed by test result. GLPOLY never delivered defective products but had all products meet customers’ requirements, no matter the performance or physical properties.

GLPOLY modified the raw materials and reduced particle size by nano-grinder, improving particle contact and heat transfer. Automated production processes could eliminate artificial error and keep consistancy of product.

2018, a 5G telecon equipment manufacturer contacted me, he need a high performance thermal gel, thermal condutctivity should be 5-6W/mK. He said he had tested at least eight samples from five suppliers, but found no one satisfied. lower performance as it shoud be comparing with specification. I understood what he said, because many competitors bragged a liitle about their products, I promised that GLPOLY provided real thing, all data must comply with test result. Customer decided to test 5.0W/mK thermal gel after reviewing data sheet.

Reliability test lasted for 10 months, no matter thermal performance or physical properties, were approved by customer. We haven’t received quality complaint from customer in the past two years.

GLPOLY thermal gel XK-G50 has following advantages:

1. Thermal conductivity 5.0W/mK, few of competitors can make it;

2. Low thermal resistance, wetting-out interface, decreasing contact resistance;

3. Automated production process, eliminating artificial error;

GLPOLY thermal interface materials have been recognized by DT Mobile, TINNO Mobile,Huawei, dJI Innovation, Freetech Pilot, GAC NEand NIO Automotive etc., helping customers protect their brand reputation and design breakthroughs.

GLPOLY Thermal gel XK-G50, taking top spot on the list ofsimilar product supply.



Send product request

To: Shenzhen Goldlink Tongda electronics Co,.Ltd
Your E-mail:
Message text:


Send to other suppliers

Other supplier products

XK-D20L
XK-D20L Features Thermalconductivity2.0W/(m.K),lowstress Excellentelectricalinsulation,bondingstrength≥13Mpa Applicationtemperature:-45~175℃,Shortterm...
XK-P110
XK-P110 Features Thermal conductivity 11.0W/mK Low thermal impedance Good electrical insualtion Ease ofhandling Applications Automotive electronics...
XK-S20
XK-S20 Features Thermal conductivity 2.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1...
XK-D30
XK-D30 Features Thermalconductivity3.0W/(m.K),flammabilityUL94-V0 Excellentelectricalinsulation,bondingstrength≥13Mpa Applicationtemperature:-45~123℃...
XK-GN30
XK-GN30 Features High thermal performance Low thermal resistance Ultra conforming Low stress, non pump-out Applications Automotive electronics Coms...
All supplier products

Same products

RFID Silicone Wristband
RFID Silicone Wristband Seller: Shenzhen DTB RFID Co., Ltd. RFID Silicone Wristband RFID wristbands combine RFID technology with good looking and practical ...
XK-G20
XK-G20 Seller: Shenzhen Goldlink Tongda electronics Co,.Ltd Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with we...
XK-G40
XK-G40 Seller: Shenzhen Goldlink Tongda electronics Co,.Ltd Features Thermal conductivity 4.0W/mK Low thermal resistance Ultra thin bondline Conforming wit...
XK-G50
XK-G50 Seller: Shenzhen Goldlink Tongda electronics Co,.Ltd Features Thermal conductivity 5.0W/mK Low thermal resistance Ultra thin bondline Conforming wit...
XK-G60
XK-G60 Seller: Shenzhen Goldlink Tongda electronics Co,.Ltd Features Thermalconductivity6.0W/mK Lowthermalimpedance Ultralowcompressionforce Long-termrelia...